HBM Memory — Hiring
Updated 6/19/2026
63 engineering roles posted in the last 90 days across companies the engine tracks for HBM Memory.
Top specialties (last 90d)
| Specialty | Roles |
|---|---|
| advanced packaging | 4 |
| memory test | 4 |
| DRAM circuit design | 3 |
| HBM integration | 3 |
| HBM4 | 2 |
| hybrid bonding | 2 |
| KGSD | 2 |
| HBM reliability | 1 |
| HBM product management | 1 |
| AI accelerator customer engineering | 1 |
Top hiring companies (last 90d)
6 of these companies also appear as "committing" against products on the Products module — that's where hiring lines up with announced product direction.
| Company | Roles | Committed products |
|---|---|---|
| TSMC | 14 | HBM4 12-high 36GB Stack, CoWoS-L Advanced Packaging (HBM Interposer + Base Die), AI Accelerator with HBM4 (NVIDIA Rubin / AMD MI455X class) |
| SK Hynix | 13 | HBM3E 12-high 36GB Stack, HBM4 12-high 36GB Stack, Cu-Cu Hybrid Bonding (Post-HBM4 Stacked Memory) |
| Samsung Electronics | 13 | HBM3E 12-high 36GB Stack, HBM4 12-high 36GB Stack, HBM Known-Good-Stack Die (KGSD) Test Program |
| Amkor Technology | 11 | HBM3E 12-high 36GB Stack, CoWoS-L Advanced Packaging (HBM Interposer + Base Die), HBM Known-Good-Stack Die (KGSD) Test Program |
| ASE Technology | 9 | CoWoS-L Advanced Packaging (HBM Interposer + Base Die), FOCoS-Bridge 2.5D Package (ASE), HBM Known-Good-Stack Die (KGSD) Test Program |
| Micron Technology | 3 | HBM3E 12-high 36GB Stack, HBM4 12-high 36GB Stack, AI Accelerator with HBM4 (NVIDIA Rubin / AMD MI455X class) |
Updated weekly · window: last 90 days.
→ Get this data as JSONLast updated: Jun 19, 2026