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SK Hynix
HBM3E 12-high lead supplier to NVIDIA; first to complete HBM4 development, ramping for Rubin
HQ KR
Recent Business Signals
Jul 10, 2026
ipo_event
SK Hynix plans to raise $29.4 billion (45.45 trillion won) via a Nasdaq IPO, with trading expected to begin on July 10, 2026.
source: funding-research
Jul 10, 2026
ipo_event
SK Hynix is set to begin trading on Nasdaq via depositary receipts, raising $29.4 billion (₩45.45 trillion) in a U.S. listing managed by Goldman Sachs and JP Morgan.
source: funding-research
Jun 24, 2026
ipo_event
SK Hynix filed for a $29.4 billion (45.45 trillion won) US IPO on Nasdaq on June 24, 2026, with trading set to begin July 10, 2026, to fund HBM production capacity expansion.
source: funding-research
Jun 24, 2026
ipo_event
SK Hynix filed regulatory paperwork for a $29.4 billion (45.45 trillion won) US listing, with trading expected to start July 10, 2026.
source: funding-research
Jun 1, 2026
partnership
SK Hynix announced a new US-based AI solutions company with a $10 billion commitment, led by Yotta Capital Partners and NGP Capital with strategic investments from NVIDIA and BNP Paribas.
source: funding-research
May 27, 2026
ipo_event
SK Hynix's market capitalization crossed $1 trillion after an 11% share surge, with shares up 250% year-to-date.
source: funding-research
May 27, 2026
company_fact
SK Hynix's market capitalization surpassed $1 trillion on May 27, 2026, following an approximately 11% share surge driven by AI memory demand.
source: funding-research
May 27, 2026
company_fact
SK Hynix's market capitalization reached $1 trillion after shares surged over 11% in a single day, driven by HBM demand for AI servers.
source: funding-research
Funding & valuation history
Jul 10, 2026 · funding-research
SK Hynix plans to raise $29.4 billion (45.45 trillion won) via a Nasdaq IPO, with trading expected to begin on July 10, 2026.
Jul 10, 2026 · funding-research
SK Hynix is set to begin trading on Nasdaq via depositary receipts, raising $29.4 billion (₩45.45 trillion) in a U.S. listing managed by Goldman Sachs and JP Morgan.
Jun 24, 2026 · funding-research
SK Hynix filed regulatory paperwork for a $29.4 billion (45.45 trillion won) US listing, with trading expected to start July 10, 2026.
Jun 24, 2026 · funding-research
SK Hynix filed for a $29.4 billion (45.45 trillion won) US IPO on Nasdaq on June 24, 2026, with trading set to begin July 10, 2026, to fund HBM production capacity expansion.
May 27, 2026 · funding-research
SK Hynix's market capitalization crossed $1 trillion after an 11% share surge, with shares up 250% year-to-date.
May 27, 2026 · funding-research
SK Hynix's market capitalization reached $1 trillion after shares surged over 11% in a single day, driven by HBM demand for AI servers.
May 27, 2026 · funding-research
SK Hynix's market capitalization surpassed $1 trillion on May 27, 2026, following an approximately 11% share surge driven by AI memory demand.
Dec 1, 2025 · funding-research
SK Hynix received ₩500 billion (~$360 million) in corporate grant/loan funding led by Korea Development Bank.
Dec 1, 2024 · funding-research
SK Hynix received a $458 million direct grant from the U.S. Department of Commerce under the CHIPS Act to support a $3.87 billion HBM fabrication plant in West Lafayette, Indiana.
Dec 1, 2024 · funding-research
SK Hynix received a $458 million CHIPS Act grant from the US Department of Commerce to support a $3.87 billion HBM advanced packaging and R&D facility in West Lafayette, Indiana.
Strategic Position
What they do best
Volume-shipping the densest HBM stacks earliest — first to ship 12-high HBM3E to Nvidia in March 2025 (signal b67476b0) and first to complete HBM4 in September 2025 (signal fe64f30f).
Their bet
Lock the Nvidia Rubin socket via HBM4 on TSMC N3 base die (signal 910ed7ff) while the 20T won M15X fab (signal 9516af7d) absorbs the 2026-2027 capacity wave.
Top risk
Samsung clearing Nvidia HBM3E qualification in the next 6 months would crack the single-source pricing power that drove the 41% Q2 operating margin.
Compared to peers
Direct competitor
Samsung Electronics
Same HBM product roadmap but stuck on Nvidia HBM3E qualification delays; SK Hynix is the incumbent ~50% share leader.
Substitute
Micron Technology
US-strategic CHIPS Act hedge with HBM3E 12-Hi; one node behind on HBM4 (2026 roadmap vs SK Hynix mass-production-ready in 2025).
Why someone would join
- 1.Q3 2025 operating profit hit 11.4T won with HBM >40% of DRAM revenue (signal 6c2b52c8) — engineers join the highest-margin memory franchise in the industry, not a turnaround story.
- 2.Open reqs span the full HBM4 stack — principal DRAM design, TSV integration, hybrid bonding, signal integrity, KGSD test — meaning new hires touch the first product shipping into Nvidia Rubin in 2026.
Recent Hiring (60 days)
- hybrid bonding1
- advanced packaging1