{"slug":"hbm-memory","title":"HBM Memory","tagline":"The bandwidth bottleneck that decides every training-cluster TCO.","hub_url":"/topic/hbm-memory","counts":{"companies":6,"business_signals_90d":0,"talent_signals":0,"jobseeker_profiles":4,"fit_scores":0},"companies":[{"slug":"sk-hynix","name":"SK Hynix","primary_layer":"L2","description":"HBM market leader (~50% share). HBM3E volume production lead; HBM4 sample shipments. Primary supplier into NVIDIA H100/H200/B200 + B100 platforms.","profile_url":"/companies/sk-hynix"},{"slug":"samsung-electronics","name":"Samsung Electronics","primary_layer":"L2","description":"HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.","profile_url":"/companies/samsung-electronics"},{"slug":"micron-technology","name":"Micron Technology","primary_layer":"L2","description":"HBM third entrant (~20% share). US-strategic supplier; CHIPS Act direct beneficiary. HBM3E 12-Hi stack the current product anchor; HBM4 roadmap announced for 2026.","profile_url":"/companies/micron-technology"},{"slug":"tsmc","name":"TSMC","primary_layer":"L2","description":"CoWoS advanced packaging — the constrained step for AI accelerator + HBM integration. CoWoS-S / -L / -R / SoIC capacity expansion is the most-tracked supply-side number in 2026 AI infrastructure.","profile_url":"/companies/tsmc"},{"slug":"ase-technology","name":"ASE Technology","primary_layer":"L2","description":"Worlds largest OSAT (outsourced semiconductor assembly + test). FOCoS-Bridge packaging is the merchant alternative to TSMC CoWoS — capacity ramp watched for cost-of-AI relief.","profile_url":"/companies/ase-technology"},{"slug":"amkor-technology","name":"Amkor Technology","primary_layer":"L2","description":"US-based OSAT. Arizona advanced-packaging facility under CHIPS Act funding; positioned for US-sourced HBM + chiplet packaging — geopolitical hedge against TSMC concentration.","profile_url":"/companies/amkor-technology"}],"personas":[{"segment_id":"HBM-MEM-SYS-ENG-01","one_liner":"Memory systems engineer designing accelerator-memory integration.","url":"/topic/hbm-memory/personas/HBM-MEM-SYS-ENG-01"},{"segment_id":"HBM-PACKAGING-ENG-01","one_liner":"Advanced-packaging integration engineer; CoWoS / SoIC / FOCoS-Bridge.","url":"/topic/hbm-memory/personas/HBM-PACKAGING-ENG-01"},{"segment_id":"HBM-SUPPLY-ANALYST-01","one_liner":"Supply-chain analyst at memory vendor / sell-side covering HBM allocation politics.","url":"/topic/hbm-memory/personas/HBM-SUPPLY-ANALYST-01"},{"segment_id":"HBM-PROCURE-SOURCING-01","one_liner":"Memory-procurement lead at hyperscaler / accelerator vendor.","url":"/topic/hbm-memory/personas/HBM-PROCURE-SOURCING-01"}],"generated_at":"2026-05-14T16:52:49.897Z"}