Companies in Optical Modules
23 active companies tracked.
L4
AMD
MI300 / MI325 / MI350 Instinct accelerator family — the dominant merchant alternative to NVIDIA in AI training silicon. ROCm software stack maturity is the primary watch-point.
L2
Arista Networks
Cloud-networking incumbent. AI-spine + leaf switch deployments at the top hyperscalers. EOS software the named differentiator vs Cisco / Juniper. NVIDIA Spectrum-X partnership.
L4
Arm Holdings
CPU architecture and IP licensing — the instruction set and core designs behind data center CPUs (Grace, Graviton) and edge AI.
L2
Astera Labs
Connectivity silicon for AI infrastructure — PCIe/CXL retimers and smart cable modules for GPU scale-up fabrics.
L1
Bloom Energy
Solid-oxide fuel-cell power systems. AI-datacenter angle: on-site behind-the-meter generation that bypasses 5-7yr grid interconnect queues. Named in 2025-2026 hyperscaler PPA announcements.
L4
Broadcom Inc.
Custom AI silicon and networking — co-designs hyperscaler accelerator ASICs (e.g. Google TPU) and supplies Ethernet switch and SerDes silicon for AI fabrics.
L2
Ciena
Optical networking systems — coherent DCI and transport gear that connects data centers at scale.
L2
Coherent Corp.
Photonics, lasers, and optical materials — indium-phosphide lasers and components for 800G/1.6T transceivers and CPO.
L2
Credo Technology
Active electrical cables (AECs) + retimer + serdes ICs. AEC adoption inside racks the cheaper alternative to optical for sub-7m runs. 800G / 1.6T product cycle.
L1
Digital Realty
Largest colo REIT by footprint. PlatformDIGITAL fabric ties multi-tenant + hyperscaler power-shell builds. Pre-leased pipeline a tracked watch-point for AI demand visibility.
L2
Eoptolink Technology
Optical transceiver manufacturer — high-volume 800G/1.6T modules for AI cluster interconnect.
L1
Equinix
Interconnection-dense colo prime. xScale joint venture for hyperscale build. Higher revenue-per-MW vs Digital Realty due to interconnect mix.
L1
Generac
Backup power systems. Datacenter segment for diesel + natural-gas standby generators. AI-cluster MW-class backup at 99.999% availability requirements is a growth tailwind.
L2
Innolight Technology
High-volume optical transceiver maker — 800G/1.6T pluggable modules for AI data center interconnect.
L2
Lumentum Holdings Inc.
Photonics components — lasers and optical components for datacom transceivers and co-packaged optics.
L2
MACOM Technology Solutions Holdings, Inc.
Analog & mixed-signal semiconductors — laser drivers, TIAs, and high-speed components for optical and RF networking.
L4
Marvell Technology, Inc.
Custom compute and connectivity silicon — designs hyperscaler AI ASICs (e.g. AWS Trainium) plus optical DSPs and SerDes.
L3
Micron Technology
HBM third entrant (~20% share). US-strategic supplier; CHIPS Act direct beneficiary. HBM3E 12-Hi stack the current product anchor; HBM4 roadmap announced for 2026.
L1
Modine Manufacturing
Thermal management OEM. Datacenter segment for CDU (coolant distribution unit) + chillers. Pivoted from auto thermal to datacenter as the priority business; renamed segment to Climate Solutions.
L4
NVIDIA
The dominant AI accelerator vendor — GPUs (H100/B200/GB200), NVLink, and the CUDA software stack that anchors AI training and inference.
L1
Powell Industries
Custom-engineered electrical equipment — medium-voltage switchgear and power control systems for data center and industrial power distribution.
L5
Super Micro Computer
AI server and rack systems — high-density GPU servers and liquid-cooled, rack-scale systems for AI clusters.
L1
Vertiv
Power + thermal infrastructure for hyperscale + colocation data centers. UPS / switchgear / busway / rack PDU / liquid cooling. The most-mentioned name on hyperscaler datacenter capex commentary.