Companies in Optical Modules
25 active companies tracked.
L4
AMD
MI300 / MI325 / MI350 Instinct accelerator family — the dominant merchant alternative to NVIDIA in AI training silicon. ROCm software stack maturity is the primary watch-point.
L2
Arista Networks
Cloud-networking incumbent. AI-spine + leaf switch deployments at the top hyperscalers. EOS software the named differentiator vs Cisco / Juniper. NVIDIA Spectrum-X partnership.
L4
Arm Holdings
CPU architecture and IP licensing — the instruction set and core designs behind data center CPUs (Grace, Graviton) and edge AI.
L2
Astera Labs
Connectivity silicon for AI infrastructure — PCIe/CXL retimers and smart cable modules for GPU scale-up fabrics.
L1
Bloom Energy
Solid-oxide fuel-cell power systems. AI-datacenter angle: on-site behind-the-meter generation that bypasses 5-7yr grid interconnect queues. Named in 2025-2026 hyperscaler PPA announcements.
L4
Broadcom Inc.
Custom AI silicon and networking — co-designs hyperscaler accelerator ASICs (e.g. Google TPU) and supplies Ethernet switch and SerDes silicon for AI fabrics.
L2
Celestial AI
IP and systems company specializing in optical interconnects for AI scale-up, coupling photonic devices into interposers.
L2
Ciena
Optical networking systems — coherent DCI and transport gear that connects data centers at scale.
L2
Coherent Corp.
Photonics, lasers, and optical materials — indium-phosphide lasers and components for 800G/1.6T transceivers and CPO.
L2
Credo Technology
Active electrical cables (AECs) + retimer + serdes ICs. AEC adoption inside racks the cheaper alternative to optical for sub-7m runs. 800G / 1.6T product cycle.
L1
Digital Realty
Largest colo REIT by footprint. PlatformDIGITAL fabric ties multi-tenant + hyperscaler power-shell builds. Pre-leased pipeline a tracked watch-point for AI demand visibility.
L2
Eoptolink Technology
Optical transceiver manufacturer — high-volume 800G/1.6T modules for AI cluster interconnect.
L1
Equinix
Interconnection-dense colo prime. xScale joint venture for hyperscale build. Higher revenue-per-MW vs Digital Realty due to interconnect mix.
L1
Generac
Backup power systems. Datacenter segment for diesel + natural-gas standby generators. AI-cluster MW-class backup at 99.999% availability requirements is a growth tailwind.
L2
Innolight Technology
High-volume optical transceiver maker — 800G/1.6T pluggable modules for AI data center interconnect.
L2
Lightmatter
Provides optical interconnect solutions and photonic engines for AI data centers, pushing chiplet-based architectures.
L2
Lumentum Holdings Inc.
Photonics components — lasers and optical components for datacom transceivers and co-packaged optics.
L2
MACOM Technology Solutions Holdings, Inc.
Analog & mixed-signal semiconductors — laser drivers, TIAs, and high-speed components for optical and RF networking.
L4
Marvell Technology, Inc.
Custom compute and connectivity silicon — designs hyperscaler AI ASICs (e.g. AWS Trainium) plus optical DSPs and SerDes.
L3
Micron Technology
HBM third entrant (~20% share). US-strategic supplier; CHIPS Act direct beneficiary. HBM3E 12-Hi stack the current product anchor; HBM4 roadmap announced for 2026.
L1
Modine Manufacturing
Thermal management OEM. Datacenter segment for CDU (coolant distribution unit) + chillers. Pivoted from auto thermal to datacenter as the priority business; renamed segment to Climate Solutions.
L4
NVIDIA
The dominant AI accelerator vendor — GPUs (H100/B200/GB200), NVLink, and the CUDA software stack that anchors AI training and inference.
L1
Powell Industries
Custom-engineered electrical equipment — medium-voltage switchgear and power control systems for data center and industrial power distribution.
L5
Super Micro Computer
AI server and rack systems — high-density GPU servers and liquid-cooled, rack-scale systems for AI clusters.
L1
Vertiv
Power + thermal infrastructure for hyperscale + colocation data centers. UPS / switchgear / busway / rack PDU / liquid cooling. The most-mentioned name on hyperscaler datacenter capex commentary.