Advanced Packaging (CoWoS & SoIC) — Timeline

Apr 15, 2024

Samsung Electronics secured up to $6.4 billion in direct funding under the U.S. CHIPS...

Samsung Electronics secured up to $6.4 billion in direct funding under the U.S. CHIPS and Science Act to expand semiconductor manufacturing in the United States.

Jul 1, 2024

Amkor Technology received up to $400 million in direct CHIPS Act funding plus $200...

Amkor Technology received up to $400 million in direct CHIPS Act funding plus $200 million in loans from the U.S. Department of Commerce for advanced packaging capacity in Arizona.

Jul 18, 2024

Amkor Technology and Infineon Technologies announced a decarbonization and sustainability partnership covering their shared...

Amkor Technology and Infineon Technologies announced a decarbonization and sustainability partnership covering their shared manufacturing operations.

Jul 26, 2024

Amkor Technology signed a CHIPS Act memorandum with the U.S. Department of Commerce committing...

Amkor Technology signed a CHIPS Act memorandum with the U.S. Department of Commerce committing to a $2 billion advanced packaging facility in Arizona.

Dec 1, 2024

SK Hynix received a $458 million direct grant from the U.S. Department of Commerce...

SK Hynix received a $458 million direct grant from the U.S. Department of Commerce under the CHIPS Act to support a $3.87 billion U.S. investment program (primarily in HBM and advanced packaging).

Dec 1, 2025

SK Hynix received approximately ₩500 billion (~$360 million) in Korean corporate grant/loan funding led...

SK Hynix received approximately ₩500 billion (~$360 million) in Korean corporate grant/loan funding led by Korea Development Bank.

May 27, 2026

SK Hynix's market capitalization crossed $1 trillion following an 11% single-day share surge, with...

SK Hynix's market capitalization crossed $1 trillion following an 11% single-day share surge, with shares up 250% year-to-date as of May 2026.

Jun 1, 2026

ASE increased its 2026 capital expenditure to a record US$7 billion, up 27% from...

ASE increased its 2026 capital expenditure to a record US$7 billion, up 27% from 2024's US$5.5 billion, to meet AI-driven advanced packaging demand.

Jun 1, 2026

ASE raised its 2026 LEAP advanced packaging revenue outlook by approximately 10% to more...

ASE raised its 2026 LEAP advanced packaging revenue outlook by approximately 10% to more than US$3.5 billion, driven by AI customer demand.

Jun 15, 2026

TSMC advanced packaging capacity (CoWoS, SoIC) is expected to improve supply conditions materially by...

TSMC advanced packaging capacity (CoWoS, SoIC) is expected to improve supply conditions materially by end-2026, reducing the chronic AI chip packaging undersupply that constrained shipments in 2024–2025.

Jun 15, 2026

UCI-Express chiplet interconnect standard is advancing to higher speeds, as highlighted in a June...

UCI-Express chiplet interconnect standard is advancing to higher speeds, as highlighted in a June 2026 Hacker News story on chiplet interconnect technology.

Jun 15, 2026

Intel's 288-core Xeon data center chip is reported to use 12 separate chiplets built...

Intel's 288-core Xeon data center chip is reported to use 12 separate chiplets built on the 18A process node with advanced 3D stacking packaging.

Jun 15, 2026

Intel is reportedly pursuing an OSAT-like external packaging services strategy, aiming to offer Foveros...

Intel is reportedly pursuing an OSAT-like external packaging services strategy, aiming to offer Foveros and EMIB to chipmakers beyond Intel's own product lines.

Jun 15, 2026

Intel is publicly described as 'going all-in on advanced chip packaging' as of June...

Intel is publicly described as 'going all-in on advanced chip packaging' as of June 2026, signaling a strategic pivot toward packaging as a revenue and differentiation lever.

Jun 15, 2026

Intel's advanced packaging portfolio spans Foveros (3D face-to-face stacking), EMIB (2.5D embedded multi-die interconnect...

Intel's advanced packaging portfolio spans Foveros (3D face-to-face stacking), EMIB (2.5D embedded multi-die interconnect bridge), and a potential next-generation Z-Angle technology; technical community observers assess Intel as the current industry leader in chiplet packaging breadth.

Jun 15, 2026

ASE Technology stock surged 77.1% over a 3-month period as of June 2026.

Jun 15, 2026

Community estimates place Nvidia's share of TSMC's CoWoS capacity at approximately 60%, a share...

Community estimates place Nvidia's share of TSMC's CoWoS capacity at approximately 60%, a share that is described as stable while total CoWoS capacity roughly doubles in 2026.

Jun 15, 2026

AMD's current high-end processors use a chiplet architecture with multiple smaller dies interconnected on...

AMD's current high-end processors use a chiplet architecture with multiple smaller dies interconnected on a package, creating multi-NUMA-node configurations with memory affinity implications for software workloads.

Jun 15, 2026

Intel's 18A process node is making its data center debut with the 288-core Xeon...

Intel's 18A process node is making its data center debut with the 288-core Xeon chip, characterized by Hacker News community observers as Intel's 'make-or-break' process milestone.

Jun 15, 2026

Inter-chiplet energy and latency trade-offs are an active area of technical optimization, with Intel's...

Inter-chiplet energy and latency trade-offs are an active area of technical optimization, with Intel's EMIB cited by community observers as a focused improvement target for reducing inter-die communication overhead.

Jun 15, 2026

TSMC's CoWoS supply-demand gap is reportedly narrowing from approximately 20% to 10% by end-2026,...

TSMC's CoWoS supply-demand gap is reportedly narrowing from approximately 20% to 10% by end-2026, signaling a material improvement in advanced packaging capacity balance.

Jun 15, 2026

Apple's M5 Pro and M5 Max chips use a dual-die chiplet architecture, comparable to...

Apple's M5 Pro and M5 Max chips use a dual-die chiplet architecture, comparable to approaches used in Nvidia GB10 and AMD Strix Halo, as noted in June 2026 technical community discussions.

Jun 16, 2026

Advanced packaging is described as 'the new frontline of the AI chip race' in...

Advanced packaging is described as 'the new frontline of the AI chip race' in multiple June 2026 industry publications, reflecting consensus that packaging—not transistor density alone—determines AI infrastructure capacity.

Jun 16, 2026

AI compute constraints are increasingly shifting from transistor density (Moore's Law) to package area,...

AI compute constraints are increasingly shifting from transistor density (Moore's Law) to package area, as argued by semiconductor analyst Dr. Robert Castellano in a June 2026 article.

Jun 16, 2026

TSMC and Amkor Technology signed a 10-year deal to expand semiconductor packaging operations in...

TSMC and Amkor Technology signed a 10-year deal to expand semiconductor packaging operations in Arizona.

Jun 16, 2026

TSMC is reportedly collaborating with Japanese substrate supplier Ibiden and Taiwan's Innolux to advance...

TSMC is reportedly collaborating with Japanese substrate supplier Ibiden and Taiwan's Innolux to advance CoPoS (Chip on Package on Substrate) technology and glass substrates.

Jun 18, 2026

Amkor Technology posted strong AI-driven revenue growth as of mid-2026, affirming sustained demand for...

Amkor Technology posted strong AI-driven revenue growth as of mid-2026, affirming sustained demand for its outsourced semiconductor assembly and test services.

Jun 18, 2026

Amkor Technology is characterized by industry analysts as an 'arms dealer' in the TSMC-vs-Intel...

Amkor Technology is characterized by industry analysts as an 'arms dealer' in the TSMC-vs-Intel advanced packaging battle, supplying packaging services agnostically to customers across both foundry ecosystems.

Jun 18, 2026

TSMC is characterized by industry commentators as holding a near-monopoly in AI-grade advanced packaging...

TSMC is characterized by industry commentators as holding a near-monopoly in AI-grade advanced packaging (CoWoS/SoIC) as of mid-2026, with Intel and Amkor as the principal challengers.

Jun 19, 2026

ASE Technology is experiencing margin expansion as of mid-2026, with analysts questioning whether the...

ASE Technology is experiencing margin expansion as of mid-2026, with analysts questioning whether the expansion is sustainable at current AI demand volumes.

Jun 20, 2026

Amkor stock surged materially following the announcement of the 10-year TSMC deal for Arizona...

Amkor stock surged materially following the announcement of the 10-year TSMC deal for Arizona semiconductor packaging expansion.

Jun 22, 2026

AI supply chain pressures are creating upstream demand stress on MLCC (multi-layer ceramic capacitor)...

AI supply chain pressures are creating upstream demand stress on MLCC (multi-layer ceramic capacitor) suppliers as of June 2026.

Jun 23, 2026

TSMC reported approximately 30% revenue growth driven by AI chip demand surge as of...

TSMC reported approximately 30% revenue growth driven by AI chip demand surge as of June 2026.

Jul 10, 2026

SK Hynix is scheduled to begin trading on Nasdaq via depositary receipts in July...

SK Hynix is scheduled to begin trading on Nasdaq via depositary receipts in July 2026, targeting a raise of $29.4 billion (₩45.45 trillion) in a U.S. listing.

Sep 1, 2026

News Mention: Amkor Technology stock holds steady as new capex plans and dividend timetable shape 2026...

Amkor Technology stock holds steady as new capex plans and dividend timetable shape 2026 outlook - AD HOC NEWS <a href="https://news.google.com/rss/articles/CBMixAFBVV95cUxOWEtoV3VLNTJZRThpRDdvMGhZelFONWRnUzI0alZrQmE1UFdRdzVwZDhTUDJ6aG1HeHFxNy11NUlvTTZ2RTQwdkNLbUg4Ykpsb28zSDZ0UDRtckJMbFVOOS1ZaVB1SHBPMkE0UDJ3N1I4bVVVSjV2aS1Mc215d2NmYmtxZkI5OXB0MTRva0VESmtwX25VT2NaSUxTc3k5b1owelZzVUtlSldRTDB2UXZqWUw1Y2FZemhzUU1reENGWm1qemZQ?oc=5" target="_blank">Amkor Technology stock holds steady as new capex plans and dividend timetable shape 2026 outlook</a>&nbsp;&nbsp;<font color="#6f6f6f">AD HOC NEWS</font>

Sep 1, 2026

News Mention: TSMC's 3DFabric Platform Evolves: CoWoS Transistor Integration Projected to Grow 48x by 2029 -...

TSMC's 3DFabric Platform Evolves: CoWoS Transistor Integration Projected to Grow 48x by 2029 - finance.biggo.com <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE5DSmRkaUd0MUdZclpHSHpPcExsdlltRkFDSWJIOWVsbDVuVlZqOFNBRldSaE82YzYwRXVoQlNFV0c3andWbnI2WDlQcU1PcmowTGxhYUJ6ZDc1UEdSczZfUGZXRG9McTJYQ1JFckQyRnRKMkZqS0E?oc=5" target="_blank">TSMC's 3DFabric Platform Evolves: CoWoS Transistor Integration Projected to Grow 48x by 2029</a>&nbsp;&nbsp;<font color="#6f6f6f">finance.biggo.com</font>

Sep 2, 2026

News Mention: TSMC Opens Kaohsiung Supplier Campus to Close Packaging Validation Gap - Tech Times <a...

TSMC Opens Kaohsiung Supplier Campus to Close Packaging Validation Gap - Tech Times <a href="https://news.google.com/rss/articles/CBMivwFBVV95cUxQQW1oejRtd2NDX2FRamcxMUlVenB2RkswSlQwdE5nZ21YTHdzaTVNTHFWa2lsLU1zbkh0bmh1NEFaWWx6ck9XZHJMbUFFY2ZYYVE4eUN1dXoxbjM3WFNGc0Rqb3ZUdnNVOURGWmNTdnlmS2tUYUtWQnJIS3dvZTZkSlp1R0U1dXRYeXJMeGw1RTN1ZnFGelZEMzltWk5saFBCSWtVVVc3MDR5S3loa3A0czA5NmFuMV9VSFdRSGYzNA?oc=5" target="_blank">TSMC Opens Kaohsiung Supplier Campus to Close Packaging Validation Gap</a>&nbsp;&nbsp;<font color="#6f6f6f">Tech Times</font>

Sep 3, 2026

News Mention: Taiwanese Packaging Ecosystem Adjusts to AI Boom - dominotheory.com <a href="https://news.google.com/rss/articles/CBMif0FVX3lxTE1WN3RKaU1EcVhCdF9CRjhIZ1pXNGNMaW1oUnJhSllFV2hnWU1MMTdsWXQwb0tacGdFcVh3Uk1rT2NxSEJxWWlOM0xLRXBTU01hclNZU3Fmd3A3VU9MZ0xnYkd6Uk9YU2xyWXdxN1VuY2xJbFg3aVBmbU94QktQWjg?oc=5" target="_blank">Taiwanese Packaging Ecosystem...

Taiwanese Packaging Ecosystem Adjusts to AI Boom - dominotheory.com <a href="https://news.google.com/rss/articles/CBMif0FVX3lxTE1WN3RKaU1EcVhCdF9CRjhIZ1pXNGNMaW1oUnJhSllFV2hnWU1MMTdsWXQwb0tacGdFcVh3Uk1rT2NxSEJxWWlOM0xLRXBTU01hclNZU3Fmd3A3VU9MZ0xnYkd6Uk9YU2xyWXdxN1VuY2xJbFg3aVBmbU94QktQWjg?oc=5" target="_blank">Taiwanese Packaging Ecosystem Adjusts to AI Boom</a>&nbsp;&nbsp;<font color="#6f6f6f">dominotheory.com</font>

Sep 4, 2026

News Mention: Top Advanced Packaging Stocks 2026: Scaling AI Compute - Exoswan Insights <a href="https://news.google.com/rss/articles/CBMiWEFVX3lxTFB1WkN6TWxYSEhsaTRLXzFrVC1pb0xyUzFsVVZKM1BRS2ZyQjMzamtVei1DeVdReWhwMmpSRERYbjNQODhnU0VWTS1GaVg1LWFxcnV6RHZMRDc?oc=5" target="_blank">Top...

Top Advanced Packaging Stocks 2026: Scaling AI Compute - Exoswan Insights <a href="https://news.google.com/rss/articles/CBMiWEFVX3lxTFB1WkN6TWxYSEhsaTRLXzFrVC1pb0xyUzFsVVZKM1BRS2ZyQjMzamtVei1DeVdReWhwMmpSRERYbjNQODhnU0VWTS1GaVg1LWFxcnV6RHZMRDc?oc=5" target="_blank">Top Advanced Packaging Stocks 2026: Scaling AI Compute</a>&nbsp;&nbsp;<font color="#6f6f6f">Exoswan Insights</font>

Sep 9, 2026

News Mention: Global Foundry Revenue Hits Record $53.49 Billion as TSMC Takes 72.5% Share and SMIC...

Global Foundry Revenue Hits Record $53.49 Billion as TSMC Takes 72.5% Share and SMIC Surges 20% - TelecomLead <a href="https://news.google.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

Sep 13, 2026

News Mention: TSMC's CoWoS Capacity to Double to 260,000 Wafers by 2028; Intel and OSAT Providers...

TSMC's CoWoS Capacity to Double to 260,000 Wafers by 2028; Intel and OSAT Providers Capture Spillover Orders - finance.biggo.com <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE8tYVhpVFhpdXkzTURidTlPX1JtX0NJUGRJX1ZhTTFrcWtzczVVNFBsWTI3bnNEcFFYVW9oQ0FMdkJ3M1lfOS1tSFJJSlVWUmQzUmZmcElkY2Uzd2FLemFINTFnY1BheE1vdG9NTFBjY09KUDlvc1E?oc=5" target="_blank">TSMC's CoWoS Capacity to Double to 260,000 Wafers by 2028; Intel and OSAT Providers Capture Spillover Orders</a>&nbsp;&nbsp;<font color="#6f6f6f">finance.biggo.com</font>

Sep 14, 2026

News Mention: TSMC expands advanced nodes to meet surging AI chip demand - CHOSUNBIZ - Chosunbiz...

TSMC expands advanced nodes to meet surging AI chip demand - CHOSUNBIZ - Chosunbiz <a href="https://news.google.com/rss/articles/CBMijgFBVV95cUxNeEFKU3RiT3NrMTNzSmdUREVlQU1xa3NMc1VDUGFpcEV3eGJNdVlhQm82WkE3aU16VTJPNHRKOVFtcU52Ulh4QlFVblNBX0dVVkliUC1QYXdtdVVOX0FaWmxNR2NLU0R5d0xfOGJaSUpEUVhoM2FLR3JMbEdIQXZFSnVJQWVOWVdTSS1JZERB0gGOAUFVX3lxTE14QUpTdGJPc2sxM3NKZ1RERWVBTXFrc0xzVUNQYWlwRXd4Yk11WWFCbzZaQTdpTXpVMk80dEo5UW1xTnZSWHhCUVVuU0FfR1VWSWJQLVBhd211VU5fQVpabE1HY0tTRHl3TF84YlpJSkRRWGgzYUtHckxsR0hBdkVKdUlBZU5ZV1NJLUlkREE?oc=5" target="_blank">TSMC expands advanced nodes to meet surging AI chip demand - CHOSUNBIZ</a>&nbsp;&nbsp;<font color="#6f6f6f">Chosunbiz</font>

Sep 15, 2026

News Mention: TSMC's 2nm and 3nm Capacity Expansion Gains Momentum; Monthly Output Projected to Rise Up...

TSMC's 2nm and 3nm Capacity Expansion Gains Momentum; Monthly Output Projected to Rise Up to 22% by Mid-2027 - finance.biggo.com <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE9BUlJDWF82Ny1hNXJ2THdDbDlYWHl2dUpLVjR6OFJmdU5pMU1yQ1BfaHhHeEM5SVM5cEF4UkUzc2pDdzlVejA2cEFBWkRlWUNrNldQb09CdlRwSVpOTDhhdThVU3ctLVNjZ1RTTmZZQ0xzcFNkWHc?oc=5" target="_blank">TSMC's 2nm and 3nm Capacity Expansion Gains Momentum; Monthly Output Projected to Rise Up to 22% by Mid-2027</a>&nbsp;&nbsp;<font color="#6f6f6f">finance.biggo.com</font>

Sep 15, 2026

News Mention: TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity -...

TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity - digitimes <a href="https://news.google.com/rss/articles/CBMiX0FVX3lxTE9ER3d5dzBrZ04ySU5neFZ5TjdpWkJfOVZQNWFPemJybnBQNmplRGNVd0F1SE5YU3I2Mmxua09SdnN1WWw1cWMyR29GaU45OHRDSENaY0pvbS1fVGNNNXVr?oc=5" target="_blank">TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity</a>&nbsp;&nbsp;<font color="#6f6f6f">digitimes</font>

Sep 15, 2026

News Mention: Nvidia, Apple, AWS, and MediaTek Compete for TSMC's 2/3nm and CoWoS Production Capacity -...

Nvidia, Apple, AWS, and MediaTek Compete for TSMC's 2/3nm and CoWoS Production Capacity - Bitget <a href="https://news.google.com/rss/articles/CBMiY0FVX3lxTE9PcC1VTWI0d1JXZ2FzS1JuOFp3NjZ2SnBOdzBaZXZNNzdfal9BU1l6S1RackJsTWpqQjJWX1Vib2poMElFTXZfNl8wN09JZ1lmeFZBWUQtS1lKSWVnZ0hucDJvVdIBY0FVX3lxTE9PcC1VTWI0d1JXZ2FzS1JuOFp3NjZ2SnBOdzBaZXZNNzdfal9BU1l6S1RackJsTWpqQjJWX1Vib2poMElFTXZfNl8wN09JZ1lmeFZBWUQtS1lKSWVnZ0hucDJvVQ?oc=5" target="_blank">Nvidia, Apple, AWS, and MediaTek Compete for TSMC's 2/3nm and CoWoS Production Capacity</a>&nbsp;&nbsp;<font color="#6f6f6f">Bitget</font>

Sep 18, 2026

News Mention: TSMC's Advanced Packaging Dominance Firmly Entrenched; TrendForce: CoWoS-L to Lead Through 2028 - finance.biggo.com...

TSMC's Advanced Packaging Dominance Firmly Entrenched; TrendForce: CoWoS-L to Lead Through 2028 - finance.biggo.com <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTFBub1doNGlST0ppWEFiUXBFcl9YUzF4M1o5eTdBcGhRRmFaZUUxbFlSNmRpZ2tkMzRwU0VRNFNiX2FjZFJBbVR4azc5R2NEaE5zSkJrMlM0X283U3k5eU4wNFJmY2xYeVd5emRUOGxOZ0w4Z0pWOFE?oc=5" target="_blank">TSMC's Advanced Packaging Dominance Firmly Entrenched; TrendForce: CoWoS-L to Lead Through 2028</a>&nbsp;&nbsp;<font color="#6f6f6f">finance.biggo.com</font>

Sep 18, 2026

News Mention: AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream...

AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028 - techpowerup.com <a href="https://news.google.com/rss/articles/CBMilAJBVV95cUxQNWNMRURXZWVnY3Jsb3NMV0gyVEFkb25kNENVZFlLNEgzR0RDb3RLMll5eFVMY2k3anpWOFhYcUZXT3U0ZjRTdm5zbG5xMHhNN1FJU3pjV1Y0X1J5X283bS1xcEtMZVZHeHVadUdJcDFMTXNWMGdFNkpiTExJX1Etb0dJaVN5WjRhOEJNX2hiT256ejN4NXpBbEFHOGNrMFZFaXNLRDRYWVhncTRzLWhWTDlYeEhTRkVleFdHbjcwaW5WaW5TbG1ucUZGRFZ5RzdtQUpleU9tVTkydkpSTXpwSHAxTVlxZUtQSHJ4SFdXeFdCOFZiRExhQzVRR1ZvXy12OEg1azhLM3hyQWpJNkFjd0sxWEw?oc=5" target="_blank">AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028</a>&nbsp;&nbsp;<font colo

Sep 18, 2026

News Mention: CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028 - I-Connect007 <a href="https://news.google.com/rss/articles/CBMiuAFBVV95cUxQSHpZT2YxZDg1RVNZcVFjZnpwX2hockp3UHNsUFNNMDNlbklLMjdzOVNqR1FLYmRNRnRLbjBsNXVkM3FpMklMUXdyVEZrQjJnQUdQaFA1OTR2eXB5d0JaY0l6WmRhb1FiekFia3NhS1VSeUozamlNVGRpYWtuQlF6WF8ybl85aExtU1BZMVA4LThEZ0JHTXVEOVdJYi1vR3JyTDJiakZCQlBtOVFfUHJDbjkwZnFkOV85?oc=5"...

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028 - I-Connect007 <a href="https://news.google.com/rss/articles/CBMiuAFBVV95cUxQSHpZT2YxZDg1RVNZcVFjZnpwX2hockp3UHNsUFNNMDNlbklLMjdzOVNqR1FLYmRNRnRLbjBsNXVkM3FpMklMUXdyVEZrQjJnQUdQaFA1OTR2eXB5d0JaY0l6WmRhb1FiekFia3NhS1VSeUozamlNVGRpYWtuQlF6WF8ybl85aExtU1BZMVA4LThEZ0JHTXVEOVdJYi1vR3JyTDJiakZCQlBtOVFfUHJDbjkwZnFkOV85?oc=5" target="_blank">CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028</a>&nbsp;&nbsp;<font color="#6f6f6f">I-Connect007</font>

Sep 22, 2026

News Mention: Beyond Capacity Expansion: TSMC Builds an Advanced Packaging Validation Hub in Kaohsiung - semivision...

Beyond Capacity Expansion: TSMC Builds an Advanced Packaging Validation Hub in Kaohsiung - semivision <a href="https://news.google.com/rss/articles/CBMihAFBVV95cUxOd0xxaG9OQ2t4MGxEcVh0b0hPWWNEM3BEU0lUU1BOQmF1UkdkN1Z3djF2bm9aSjNfMWt0RmlmdWxoN08yX3ZRdkdVOVltU3c4VFhZYUwwelJuNTVUaTVaenltcnhOLWtOVzlpc2lQcEVLS01aMm1uMWdwMk8wS3lMeTQ4djY?oc=5" target="_blank">Beyond Capacity Expansion: TSMC Builds an Advanced Packaging Validation Hub in Kaohsiung</a>&nbsp;&nbsp;<font color="#6f6f6f">semivision</font>

Sep 22, 2026

News Mention: Why Is TSMC Critical to the AI Boom? $64 Billion Capex, 66% HPC Revenue...

Why Is TSMC Critical to the AI Boom? $64 Billion Capex, 66% HPC Revenue and CoWoS Expansion Explain Its Role - InfotechLead <a href="https://news.google.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

Sep 27, 2026

News Mention: Taiwan's Chiayi Science Park Phase 3 Expansion Kicks Off; TSMC Reportedly Plans 5 Additional...

Taiwan's Chiayi Science Park Phase 3 Expansion Kicks Off; TSMC Reportedly Plans 5 Additional Advanced Packaging Plants - finance.biggo.com <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTFBDZGpKd2g5S003SEVTSWxmU1pUR09LZGtFazE2MVN6Ulg2Vml0NzdycUNwaWJFYU8tVEVSRDQyR2M3SXFZWmhnMTBFWkh2X2YxUEZwN2pmQkNJOUVkTnUySHNsS2tLY0o5X2ZnVjFweGI4ZG01bVE?oc=5" target="_blank">Taiwan's Chiayi Science Park Phase 3 Expansion Kicks Off; TSMC Reportedly Plans 5 Additional Advanced Packaging Plants</a>&nbsp;&nbsp;<font color="#6f6f6f">finance.biggo.com</font>

Sep 27, 2026

News Mention: AI disruption forces $100 billion inflection point in advanced chip packaging as supply constraints...

AI disruption forces $100 billion inflection point in advanced chip packaging as supply constraints intensify - dqindia.com <a href="https://news.google.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

Sep 28, 2026

News Mention: TSMC to Add Five Advanced Packaging Plants in Chiayi, Cementing World's Largest Production Hub...

TSMC to Add Five Advanced Packaging Plants in Chiayi, Cementing World's Largest Production Hub - finance.biggo.com <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTFA4SVU4WGZpTVRGbk00UkJMSV9ITEw4YWZQbE54YjlXSEdPVGotbmpOMXJGVHowLVFzcWJVVjMwU3BSclVHOXFSMFhnTHJyTTNjdXNLODRKdEt1VUYyZS1vV2FBY1JuZVNVODZMN3VieGM0SzlhZ0E?oc=5" target="_blank">TSMC to Add Five Advanced Packaging Plants in Chiayi, Cementing World's Largest Production Hub</a>&nbsp;&nbsp;<font color="#6f6f6f">finance.biggo.com</font>

Sep 29, 2026

News Mention: AI demand drives $100 billion inflection in advanced chip packaging - ET Datacenters <a...

AI demand drives $100 billion inflection in advanced chip packaging - ET Datacenters <a href="https://news.google.com/rss/articles/CBMiogJBVV95cUxPRm9kUS0takI1NDFvd1NpNEFGSGlkSHA5WHliRzhqOFkwb2xuTExRZTl6YTVBTnV4dTVWTzh2OTVDa0dvSmZpTTIwd3BWQ3pmM2VVZVdZSk5NVVhEampYcEFhR2NLajJDQU9Ga0JnVklzRzBfaHExZVowSERET0ZHcDB3TzRrVWNCdGhzQ3J6MkpuWHJKcnphVE02WEhoSHcwbWlkems2c2tKTVRRM1ZYeFZuZEk0LWNnQkx4dEVsZzd3dlViLUpkUllOQWFVc1BFVmpoY3NaM0VxNDdQOU1vY0tHdGxZQ3BwV09iazdobWVVWU5JXy1SZmgwYlNQWTJvUXRqaTRwbDFfOVZSbFYyTG1hdVFUZ0U5OEU5c1FPNG95d9IB8AFBVV95cUxORWxkSGN5MHA3RWVYOWwxd0VNV3lFcjl2eUI5bFJWYm15QjNLSkRQMThMT1pOWDJnN0ZqWnlJYUJoT3FxdGVSVk01Z3kxNXVqZ3FPVjA3SzhBRURqZWhMRTB0clFWa3o4Z3NPNl9XVU1iZG9zS3

Sep 30, 2026

News Mention: US Wants to Break Taiwan Dependence — But Here's Why Taipei Will Remain 'Central'...

US Wants to Break Taiwan Dependence — But Here's Why Taipei Will Remain 'Central' Character in the AI Chips Story - TradingView <a href="https://news.google.com/rss/articles/CBMi_AFBVV95cUxQc1QyV3ZLM19RUkVFeDVOcXdjc0F2aXZfTHZvSjdwVkZrWmJzLUxYbXIwREVXU09jSVdNeE5WWkQtMFlsT1RhNE95b0VOM3Ntb1c4X3htd19zdUFWcjBxQ05tN2VMajh6aDR4NWFWM1daX0ZFdU1oQmZDMG1JbkRaT3JfcTNmX1FHcy1aSmQwaFhHS0xXSTRkQXpoMVhTSE5SQnVaRVdqSlpGY3pDLWk3MkNZb0x6OGtTdWVfRUhXbGQtRGNjOHZOZXdhRGZYSTNZc1B2eEd4ZTlNVFBuM3VpQWt2cXI3Y3VDcXpaNlF3NFFuSjBvNW13Y0lRU3Q?oc=5" target="_blank">US Wants to Break Taiwan Dependence — But Here's Why Taipei Will Remain 'Central' Character in the AI Chips Story</a>&nbsp;&nbsp;<font color="#6f6f6f">TradingView</font>

Sep 30, 2026

News Mention: Alphabet Begins Recognizing Revenue From TPU Systems as Google Cloud Backlog Reaches $513.9 Billion...

Alphabet Begins Recognizing Revenue From TPU Systems as Google Cloud Backlog Reaches $513.9 Billion - tokenpost.com <a href="https://news.google.com/rss/articles/CBMiW0FVX3lxTE1PN3pDcXBtNTdPUHU2TTZ3dURLcWM0azZ4YmpZQ2RQazBFNWpXYTBQMnBTWFljSmF6cFhnTlpSa01HMUU1VDFkRTIyN2xLSS1QSmZyRWlnVFVVYlU?oc=5" target="_blank">Alphabet Begins Recognizing Revenue From TPU Systems as Google Cloud Backlog Reaches $513.9 Billion</a>&nbsp;&nbsp;<font color="#6f6f6f">tokenpost.com</font>

Oct 2, 2026

News Mention: TSMC Expands Advanced Semiconductor Capacity to Support AI Demand- Spherical Insights Analysis - Spherical...

TSMC Expands Advanced Semiconductor Capacity to Support AI Demand- Spherical Insights Analysis - Spherical Insights <a href="https://news.google.com/rss/articles/CBMiqAFBVV95cUxPNlFkdm02VTBSZW10b3lqdEtSTzFHODZzOVZaczdlNmU2cGN5THA5ejhnT1YwdXVNdndzajlzQ2dEb3dhUHBGZ2tsOGRlSGlVQmFLbTRSc204OEpXTlJPZXVGb1dyZHhrWEl5end4ZDdDVnNVdG5oVEtlWVQwQTgzM2lKckRmU3VlMkpQWWt5MURfV1pILWF6RDJFalRFMUk5MUhCZmpJWnM?oc=5" target="_blank">TSMC Expands Advanced Semiconductor Capacity to Support AI Demand- Spherical Insights Analysis</a>&nbsp;&nbsp;<font color="#6f6f6f">Spherical Insights</font>

Oct 2, 2026

News Mention: TSMC vs. Amkor: TSM and AMKR, Which AI Chip Stock Is Better Suited for...

TSMC vs. Amkor: TSM and AMKR, Which AI Chip Stock Is Better Suited for Long-Term Holding? - TradingKey <a href="https://news.google.com/rss/articles/CBMiogFBVV95cUxQRzJtZlg4d2w0bGdlZ2RTRFp2WXdnZFpULXZpQ3hEMXpWcFRVS2J3ckRaX3pqRkVENjFZNXZuV2xGQjZDUnRNSUNXSF9KNlpuZUc4ZWQwZ3BZdmZCY0k1cnJMMWlLZko1RWY1WVoyNExKUEcyc21BZ2VGdzZKQm1yak04Zmk3ZlRJdk9jcDFENFdXV0NfSW9yZkRIVzdrZXUzcFE?oc=5" target="_blank">TSMC vs. Amkor: TSM and AMKR, Which AI Chip Stock Is Better Suited for Long-Term Holding?</a>&nbsp;&nbsp;<font color="#6f6f6f">TradingKey</font>

Oct 4, 2026

News Mention: AI Custom Chip Stocks Roundup: Beyond Broadcom, Which Deserves More Attention Among Marvell Technology,...

AI Custom Chip Stocks Roundup: Beyond Broadcom, Which Deserves More Attention Among Marvell Technology, TSMC, and Amkor? - TradingKey <a href="https://news.google.com/rss/articles/CBMiqAFBVV95cUxNdHAzazlpbUdCc21oSjFIN1lFUHoxcW5xbm5oSEdkRm5kbDE1OEtIbWxtNzAzQ0FYUjctS3FNNUNOUGlIN2NOMUZ5WWxvWnlCTXlhakFFTHZpbEdsNGtkTFRUWWpwZFFsMWE2V1k3Y1F5N3BtMUx5ZUdYTWNrSU0takxxU3UzWXZ4bEg3bDIwSEVXN05tX3FnWXVKUDhvb1FJSWxhSWs4b1Y?oc=5" target="_blank">AI Custom Chip Stocks Roundup: Beyond Broadcom, Which Deserves More Attention Among Marvell Technology, TSMC, and Amkor?</a>&nbsp;&nbsp;<font color="#6f6f6f">TradingKey</font>

Oct 6, 2026

News Mention: Lisa Su Makes Whirlwind Taiwan Visit to Lock in Supply, Reportedly Meets TSMC to...

Lisa Su Makes Whirlwind Taiwan Visit to Lock in Supply, Reportedly Meets TSMC to Secure Next Year's AI Capacity - BigGo Finance <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE9GODg5STZibGtHZFJOUjRhR19OTjFUQkluVjhFbFBHRzd3X1cyUUxlWktGQmFwdF9CLTFiZUNMQm94TzJiZ3FnSGJhOGlwV1Zla1U5TmZUNEJhWlh1MzZrdDlERXdnbDVKRDRIYkxlWF9jUzhCaUE?oc=5" target="_blank">Lisa Su Makes Whirlwind Taiwan Visit to Lock in Supply, Reportedly Meets TSMC to Secure Next Year's AI Capacity</a>&nbsp;&nbsp;<font color="#6f6f6f">BigGo Finance</font>

Oct 8, 2026

News Mention: GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging...

GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging - GlobalFoundries <a href="https://news.google.com/rss/articles/CBMi4gFBVV95cUxQS21UZ0Q1MFJBb3BSMlVIVV9fQ0NfMEQtVENuNFc4VFBWbGlmdnBYMWpwNi1ucVcxeDRsUGduQm0wWTdUY3pGZzBBdmFaanBlSlMxMzFaRHNfSnYxVkxvaW1mYzlHVFd5ZVp3M0ZaZGkwekVrRTBUYVZtOEZ2Y1ZkdENzZDNBcUlzWk1hcEdqVjlBakdnTmR0YWM0eE1DZlhzLWNzeVROckFvUWxqMG9Ea1JmQzJIQktBNVdVQWdVaFlNQk9hTlQydDhVMkZOY3dyQnZWanR1TUxMbWIyZXVaZFBn?oc=5" target="_blank">GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging</a>&nbsp;&nbsp;<font color="#6f6f6f">GlobalFoundries</font>

Oct 8, 2026

News Mention: TSMC Taps GlobalFoundries In $2B AI Chip Deal, Putting GFS Stock On Track To...

TSMC Taps GlobalFoundries In $2B AI Chip Deal, Putting GFS Stock On Track To Hit Over 1-Month High - TradingView <a href="https://news.google.com/rss/articles/CBMi7gFBVV95cUxPN0tDVU9tYnd2d05xUTRvU2dDa2haSC00UlZXUWk4dVBYSGMxQ3NfNHA1YVNaMkVDV3Q0NW1OZ3RmcWRCa2pldkhrNUdRdXBXaFQzUWFOSk5XT3hacFFPdUFhYWZFOGY2ajN0VFI1R3lfNVMyWjlJdWxFVlZPRGRFRm9tSmlCTjVfZG9fNHhyUlFmQThVS1BzWnM2UjZuZlhVNllZVFQ5dlY1aks2M1ItYUV0Rzc4bHZVSHVfNlk0U04wQ3RIS01lNnRUSklrS25wT1NUTGZQcmdnUllNRUJmaGd5azhJLUM0NGFrXzh3?oc=5" target="_blank">TSMC Taps GlobalFoundries In $2B AI Chip Deal, Putting GFS Stock On Track To Hit Over 1-Month High</a>&nbsp;&nbsp;<font color="#6f6f6f">TradingView</font>

Oct 8, 2026

News Mention: U.S. CoWoS Market vs TSMC: Can the U.S. Compete? - Kings Research <a href="https://news.google.com/rss/articles/CBMieEFVX3lxTE11QmRGQ2x5NE9ZSURheldBdnhlSkRVRlFuOHFXYWZpNFhDT2pjeldtTXRJSkU5T21fUi1tWjM1OVVHR1h4TGRwUFl3WnBmR2lMTFRtbHZQV0lFYTlTRzBSS0VlNGVYNnhmODRrYVluUl9OZl9xQlFVNA?oc=5"...

U.S. CoWoS Market vs TSMC: Can the U.S. Compete? - Kings Research <a href="https://news.google.com/rss/articles/CBMieEFVX3lxTE11QmRGQ2x5NE9ZSURheldBdnhlSkRVRlFuOHFXYWZpNFhDT2pjeldtTXRJSkU5T21fUi1tWjM1OVVHR1h4TGRwUFl3WnBmR2lMTFRtbHZQV0lFYTlTRzBSS0VlNGVYNnhmODRrYVluUl9OZl9xQlFVNA?oc=5" target="_blank">U.S. CoWoS Market vs TSMC: Can the U.S. Compete?</a>&nbsp;&nbsp;<font color="#6f6f6f">Kings Research</font>

Oct 8, 2026

News Mention: The first U.S. source for TSMC's chip-packaging parts is expected in New York -...

The first U.S. source for TSMC's chip-packaging parts is expected in New York - Stock Titan <a href="https://news.google.com/rss/articles/CBMivgFBVV95cUxOS0ZaQlRHSF9zalVHRlU0bVRyOXdQRHFVODRhcVN2SEk2eDNrQ0pzeER2OWQ0VzVtaFRLczJpbjA4eWQtY3Z5YUQ0c3JhMXZQNWh2M1pVQ3pYZWdtQmVCSzR0WGtYLU5LNmlndm1MRVZRQ3pQanR2WTF4RUQ3NU1HRmx0MjBMVFFYcUxhd2pIMV9BVzdha0RLNzN5R1QzbFJoTzBGUDZLeW1maGUtTTVPSlB4UG9OOEZRcG5oRkZR?oc=5" target="_blank">The first U.S. source for TSMC's chip-packaging parts is expected in New York</a>&nbsp;&nbsp;<font color="#6f6f6f">Stock Titan</font>

Oct 8, 2026

News Mention: GlobalFoundries shares rise on $2 billion TSMC agreement - Proactive financial news <a href="https://news.google.com/rss/articles/CBMicEFVX3lxTFAzVU9Wbm1Mczg5NnV1Wk9TTHk4UEtJSThpLWd2NUVrSDRYU1FPSE9ZMzFtRzJoQkN5cmlnc2d5MVA0eHNMcm91enRBRlViYmhocGNCdW1ESWJndFRFRnMtMFlwYXhfN2t5ZVN0b0U4MVU?oc=5"...

GlobalFoundries shares rise on $2 billion TSMC agreement - Proactive financial news <a href="https://news.google.com/rss/articles/CBMicEFVX3lxTFAzVU9Wbm1Mczg5NnV1Wk9TTHk4UEtJSThpLWd2NUVrSDRYU1FPSE9ZMzFtRzJoQkN5cmlnc2d5MVA0eHNMcm91enRBRlViYmhocGNCdW1ESWJndFRFRnMtMFlwYXhfN2t5ZVN0b0U4MVU?oc=5" target="_blank">GlobalFoundries shares rise on $2 billion TSMC agreement</a>&nbsp;&nbsp;<font color="#6f6f6f">Proactive financial news</font>

Oct 8, 2026

News Mention: GlobalFoundries Inks $2 Billion Deal to Supply TSMC With US-Made AI Chip Components -...

GlobalFoundries Inks $2 Billion Deal to Supply TSMC With US-Made AI Chip Components - BigGo Finance <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE0yT2hrNXhPb0o5VjgzQ0xjZFNZZ1pHSU11d3dsU24tTjQ5Y3hTTHZHdkhXbWRSaG5WOEdRVDQwbjhMcWZMeUJwTFhNWkNlclF5X2ItZTBZNnBMbjdmN0pQYWRZWlBKSHhGQkUycWp0bWV3VEZMbFE?oc=5" target="_blank">GlobalFoundries Inks $2 Billion Deal to Supply TSMC With US-Made AI Chip Components</a>&nbsp;&nbsp;<font color="#6f6f6f">BigGo Finance</font>

Oct 8, 2026

News Mention: TSMC's quarterly revenue jumped 51 percent as AI chip demand held firm - Startup...

TSMC's quarterly revenue jumped 51 percent as AI chip demand held firm - Startup Fortune <a href="https://news.google.com/rss/articles/CBMingFBVV95cUxPcF9MalNHSVljSlY3a1hNRkY1Y19tdlJ4TGRDeTZuRGhZczhOMDgtbUsyZGpmY05ZNXBVRUhYelVHdVVNSnM0YWRDSTRkOWVnaWM0RmNyWm40b3BsYVBvRS1HWWdjR3FBM1JZZXVrMnprNTlVbFpxNDNHazhoZE5YSTJwdUVDNmFxNUFXSVFtRTdlTXNWdmJtZDY2bVNDZw?oc=5" target="_blank">TSMC's quarterly revenue jumped 51 percent as AI chip demand held firm</a>&nbsp;&nbsp;<font color="#6f6f6f">Startup Fortune</font>

Oct 8, 2026

News Mention: GF To Provide Interposers For TSMC’s CoWoS Ecosystem - Semiecosystem <a href="https://news.google.com/rss/articles/CBMiekFVX3lxTE40VThOLXdBWXo2WGZLLW5lT2lWS1lEcFdDMVhRaHR6Z0hPYXd6UlphZHlzU2ExY3JTT3F2ZWt2dDk0YTI1bC0xcEhIdlFvRFF5aTFFYnBHX1VuRElaWDBnclUybHRCbDZSZVhUWjFSNnRnbHJCZGx3V3Jn?oc=5" target="_blank">GF To...

GF To Provide Interposers For TSMC’s CoWoS Ecosystem - Semiecosystem <a href="https://news.google.com/rss/articles/CBMiekFVX3lxTE40VThOLXdBWXo2WGZLLW5lT2lWS1lEcFdDMVhRaHR6Z0hPYXd6UlphZHlzU2ExY3JTT3F2ZWt2dDk0YTI1bC0xcEhIdlFvRFF5aTFFYnBHX1VuRElaWDBnclUybHRCbDZSZVhUWjFSNnRnbHJCZGx3V3Jn?oc=5" target="_blank">GF To Provide Interposers For TSMC’s CoWoS Ecosystem</a>&nbsp;&nbsp;<font color="#6f6f6f">Semiecosystem</font>

Oct 9, 2026

News Mention: TSMC and GlobalFoundries: How a $2 Billion Deal Could Reshape America’s Advanced Packaging Supply...

TSMC and GlobalFoundries: How a $2 Billion Deal Could Reshape America’s Advanced Packaging Supply Chain - semivision <a href="https://news.google.com/rss/articles/CBMifkFVX3lxTE1XdVdESnlGQzNDQWFqU3JpZ2E1aHNkVzFCTDZmUXRITkJYMEpvQjNRNWpqaG5jRGpfNkV4MWtsRjBmVkJoM0xKUjNTQUNHd2tzb3BBRTFYekwyXzFNQjlrYkszRFFSVmg0aWhKNVRHNVVaa2s3Y2lCQTNSdlBPZw?oc=5" target="_blank">TSMC and GlobalFoundries: How a $2 Billion Deal Could Reshape America’s Advanced Packaging Supply Chain</a>&nbsp;&nbsp;<font color="#6f6f6f">semivision</font>

Oct 9, 2026

News Mention: GlobalFoundries and TSMC sign $2B AI packaging deal - TNGlobal <a href="https://news.google.com/rss/articles/CBMigwFBVV95cUxPd181WjZpckZOU1lqV3BiV1dEUnY0V1JWbjNCbWFpYTBqYWNYdFpwRVNaU1MwcnVCcVVxRmRNWGJhYnZpcEk4eVdRcDBSUVF6MnRMTXgxZlplSGxRZWFHSTB2WE1RWGpoMFROOGZCWE9pSWlKTHB1LW1SNkdJc3JNcV82cw?oc=5" target="_blank">GlobalFoundries and...

GlobalFoundries and TSMC sign $2B AI packaging deal - TNGlobal <a href="https://news.google.com/rss/articles/CBMigwFBVV95cUxPd181WjZpckZOU1lqV3BiV1dEUnY0V1JWbjNCbWFpYTBqYWNYdFpwRVNaU1MwcnVCcVVxRmRNWGJhYnZpcEk4eVdRcDBSUVF6MnRMTXgxZlplSGxRZWFHSTB2WE1RWGpoMFROOGZCWE9pSWlKTHB1LW1SNkdJc3JNcV82cw?oc=5" target="_blank">GlobalFoundries and TSMC sign $2B AI packaging deal</a>&nbsp;&nbsp;<font color="#6f6f6f">TNGlobal</font>

Oct 9, 2026

News Mention: Taiwan Semiconductor Manufacturing (TSM) Posts Record Q3 Revenue And Unveils $2 Billion Supply Deal...

Taiwan Semiconductor Manufacturing (TSM) Posts Record Q3 Revenue And Unveils $2 Billion Supply Deal - Simply Wall Street <a href="https://news.google.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

Oct 9, 2026

News Mention: GlobalFoundries Can Profit From AI Without Making GPUs - 24/7 Wall St. <a href="https://news.google.com/rss/articles/CBMinwFBVV95cUxNa0plWUo2THViNFA0UUNfSjJjdFlJUW15M0JQM20tOXhHZTRKUlpiMGE4cTlsV2ZXdU8yOXhtVjFXLVB1Y3V6X1FSd1VzTU5PWnc5R2RYbHg0b0dUbV9WMDRZVUt6TjJQS1lEMktNRXF1VEJOazhRb3Y2bHh5V3ZuZVdJcFJKbHczTlVpcElMRXlxOVNCUFRCdllQSHRrUms?oc=5"...

GlobalFoundries Can Profit From AI Without Making GPUs - 24/7 Wall St. <a href="https://news.google.com/rss/articles/CBMinwFBVV95cUxNa0plWUo2THViNFA0UUNfSjJjdFlJUW15M0JQM20tOXhHZTRKUlpiMGE4cTlsV2ZXdU8yOXhtVjFXLVB1Y3V6X1FSd1VzTU5PWnc5R2RYbHg0b0dUbV9WMDRZVUt6TjJQS1lEMktNRXF1VEJOazhRb3Y2bHh5V3ZuZVdJcFJKbHczTlVpcElMRXlxOVNCUFRCdllQSHRrUms?oc=5" target="_blank">GlobalFoundries Can Profit From AI Without Making GPUs</a>&nbsp;&nbsp;<font color="#6f6f6f">24/7 Wall St.</font>

Oct 9, 2026

News Mention: GlobalFoundries and TSMC reach $2B deal for US-based silicon interposers - Manufacturing Dive <a...

GlobalFoundries and TSMC reach $2B deal for US-based silicon interposers - Manufacturing Dive <a href="https://news.google.com/rss/articles/CBMiowFBVV95cUxQbXozVGJlV2ZraVY0UUdHU3BOVkJqTGdfNVVRVlV2b3BRNkg1RXpOamVraFVUM3lDREJrcFRnQ183V1NWSGZLT25NNXFQaDNnLWVVR0oxNllEdG14ZDFXYTNZT2VfWFR5WnZOVWtpV1F3WDZUN09DWkgxdXI3ZVJQYnZrakpWYWdRcno3cUVIRVMxbGFHR3hPa0pyVTFscHFuWUVR?oc=5" target="_blank">GlobalFoundries and TSMC reach $2B deal for US-based silicon interposers</a>&nbsp;&nbsp;<font color="#6f6f6f">Manufacturing Dive</font>

Oct 9, 2026

News Mention: GlobalFoundries and TSMC partner to establish US silicon interposer supply chain for AI packaging...

GlobalFoundries and TSMC partner to establish US silicon interposer supply chain for AI packaging - New Electronics <a href="https://news.google.com/rss/articles/CBMi2wFBVV95cUxPWG1vQXFySW9CWTI0Ni1NYzFkcVNZc0xmNzVBQ3lxMW5IM0hfMnlfVlBYSmF0MTAzWEdtTGhlRXVhWDVBOWdNSF92TGNpay0yb05IQ0p1QndKNWt1bkNZc1g4YkpfWTBPcWxzXzQzblgtS0pRZTBHVmhNSHFWMnNoejF4WUxyMkY4V1VtQzYtLUlCMS13R1JIeVo1bXVDUG9hVUpfWFNqQ01idUViS0RjY3otU0syaGZ6YWhFR0k3cTlQbDhyWXA0NXlCd1E3cGctRUZtdm1CZ1hOYUk?oc=5" target="_blank">GlobalFoundries and TSMC partner to establish US silicon interposer supply chain for AI packaging</a>&nbsp;&nbsp;<font color="#6f6f6f">New Electronics</font>

Oct 10, 2026

News Mention: GlobalFoundries Lands $2 Billion TSMC Order, Establishing First US CoWoS Interposer Capacity - BigGo...

GlobalFoundries Lands $2 Billion TSMC Order, Establishing First US CoWoS Interposer Capacity - BigGo Finance <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE5RMnFPSHVfejZTSVZXZElyX0QtZWJaM2Q3S2F6RDFhR3ltQ0hUSnJxclI5STVxNFpVNU5CcFhYN2pxZ1dWUHNIQ0RINzRBYzBucUZzRnpqTzRxdjJiT18yNlI2Rl9RVmNSWW5YU2xEVmZPSUIyNVE?oc=5" target="_blank">GlobalFoundries Lands $2 Billion TSMC Order, Establishing First US CoWoS Interposer Capacity</a>&nbsp;&nbsp;<font color="#6f6f6f">BigGo Finance</font>

Oct 10, 2026

News Mention: TSMC to Have CoWoS Interposers Manufactured at GlobalFoundries - igor´sLAB <a href="https://news.google.com/rss/articles/CBMikgFBVV95cUxOZE56OFZNSklPV0VXTGE2VTF0TDlwYU9CTGpxcElNWG9nclpKTWp4RFhCdDF4Q0JZZzhJdk81aU5MLWVkTHRCSzljb3g0dGstUVFNZTZfdmNNWFRqZ3VabEZKNDVPa1dzVHEyWi1NSlJhXzdjQkpOX3JzNjVEYWN1ekxycmVoSEQwQWxrQ0dCY1cwUQ?oc=5" target="_blank">TSMC to...

TSMC to Have CoWoS Interposers Manufactured at GlobalFoundries - igor´sLAB <a href="https://news.google.com/rss/articles/CBMikgFBVV95cUxOZE56OFZNSklPV0VXTGE2VTF0TDlwYU9CTGpxcElNWG9nclpKTWp4RFhCdDF4Q0JZZzhJdk81aU5MLWVkTHRCSzljb3g0dGstUVFNZTZfdmNNWFRqZ3VabEZKNDVPa1dzVHEyWi1NSlJhXzdjQkpOX3JzNjVEYWN1ekxycmVoSEQwQWxrQ0dCY1cwUQ?oc=5" target="_blank">TSMC to Have CoWoS Interposers Manufactured at GlobalFoundries</a>&nbsp;&nbsp;<font color="#6f6f6f">igor´sLAB</font>

Oct 12, 2026

News Mention: TSMC taps U.S. interposers to speed AI chip packaging shift, pressure Korea - CHOSUNBIZ...

TSMC taps U.S. interposers to speed AI chip packaging shift, pressure Korea - CHOSUNBIZ - Chosunbiz <a href="https://news.google.com/rss/articles/CBMiekFVX3lxTE1mVWI3MXB5aElUdEhFRTJEUEp3c0UzVUZJQkcyakgzN0haSTdlSE16YWpEZHRrSzJXZElqN3FGM243blY4NDJiN2x5eS1jNERyX1d6S1hQWmlwMWIwWHFzMS1iY1Q0OGN4b2RZVFhYM0F1M1JWUnFNTXB30gGOAUFVX3lxTE85QjYzRVBONWM3ZTZkTUM1WjkzZzBsbEZHeWZFdWg4dXBWN21nWm5XbE9zU2dzV05vTHhUQnJRVHh6UFBwY2NqSjJ1SnJJZXdTV1RhMEJQUFc4ZWFwdHd4NFNQREc0QzJISHNXUXJ3NTRmOElYMTBNclEwSFF5RExGOFVrNmotNm40Z2lTMHc?oc=5" target="_blank">TSMC taps U.S. interposers to speed AI chip packaging shift, pressure Korea - CHOSUNBIZ</a>&nbsp;&nbsp;<font color="#6f6f6f">Chosunbiz</font>

Oct 12, 2026

News Mention: GlobalFoundries partners with TSMC for $2B AI Packaging Supply - Fibre Systems <a href="https://news.google.com/rss/articles/CBMilAFBVV95cUxPeVgyUkFnbG5NaDUyQ0wwTFkyRG5RTGF4clJ2LXVzSDdHX19CM3oxcW5xSXlhZFpVZjlKX3M3dnVJTnBiZm5DckFLMmRPbWJYM2E1U1V2THFfSXpyTTZ4MHEtQXA2UmpXWUpvME9MOThoZVlXYUJFZ2NLbV9Rb2ZPYWcyaVZpdWFKbXVsZUpVOWgtY3NJ?oc=5"...

GlobalFoundries partners with TSMC for $2B AI Packaging Supply - Fibre Systems <a href="https://news.google.com/rss/articles/CBMilAFBVV95cUxPeVgyUkFnbG5NaDUyQ0wwTFkyRG5RTGF4clJ2LXVzSDdHX19CM3oxcW5xSXlhZFpVZjlKX3M3dnVJTnBiZm5DckFLMmRPbWJYM2E1U1V2THFfSXpyTTZ4MHEtQXA2UmpXWUpvME9MOThoZVlXYUJFZ2NLbV9Rb2ZPYWcyaVZpdWFKbXVsZUpVOWgtY3NJ?oc=5" target="_blank">GlobalFoundries partners with TSMC for $2B AI Packaging Supply</a>&nbsp;&nbsp;<font color="#6f6f6f">Fibre Systems</font>

Oct 13, 2026

News Mention: GlobalFoundries and TSMC Reach Multi-Year $2 Billion Agreement to Establish U.S.-Based Supply of Silicon...

GlobalFoundries and TSMC Reach Multi-Year $2 Billion Agreement to Establish U.S.-Based Supply of Silicon Interposers for Advanced AI Packaging - Embedded Computing Design <a href="https://news.google.com/rss/articles/CBMirwJBVV95cUxQZ09zaWhfMXNGejZwT2hMX1ExblRKdDlLeEhkcHQ1U2tWUnpROEZhMGI1UWF5MmdJXzBaazAwTXV5LWVlYmU5bUdRX1BmbHJWU2JJel9nOHFUZkotNWxJTmE1YzBwMWFLYTRBbTB1OUEzZERNc3ljTWkycE5qTVR0MGo1N3BzMGtHcTBJeGktcFhDa1FMOFI2cUxreDNjamhuYzVpd0VWeEUyeUpvZHJISXo5NWVHckdKMzlwLWozSXY5MVVQckJPYlRzMHZJQnNjb3c1YkNDOGRfQkJzS1ZUMjRVcEtOQXRDVk1YSlZRWTV3djhhbXNLVjJnYmdCdkZNdnZBQlEzeW54bW43WEJ1a24weTRGOFBfUjQyNzI2T2xwVVl1UjFGNjBMRGJKSlk?oc=5" target="_blank">GlobalFoundries and TSMC Reach Multi-Year $2 Billion Agreement to Establish U.S.-Based Supply of Silicon Interposers for

Oct 15, 2026

News Mention: TSMC’s 2026 Q3 Earnings Call : AI Demand, A14, Texas Expansion and the Race...

TSMC’s 2026 Q3 Earnings Call : AI Demand, A14, Texas Expansion and the Race for Chip Capacity - semivision <a href="https://news.google.com/rss/articles/CBMihAFBVV95cUxPYnVXYkRNSFd2SXhUeDl3czBnck5yd0FUMl9fMk5mM095eTVIcnN3eGdKTnlBeVRaSXFVZm1mTkxtQ19WTU5pZG5zc0k1M0NaUG9wbUt1ZUlTZzQxaTFRcTBRVHlpYmhRUkRiTFVuUVRVeEtWY1dFOVdzVWt3aHprdmllTDE?oc=5" target="_blank">TSMC’s 2026 Q3 Earnings Call : AI Demand, A14, Texas Expansion and the Race for Chip Capacity</a>&nbsp;&nbsp;<font color="#6f6f6f">semivision</font>

Oct 15, 2026

News Mention: TSMC Q3 Profit May Hit Record, Teams Up With GlobalFoundries to Expand CoWoS Silicon...

TSMC Q3 Profit May Hit Record, Teams Up With GlobalFoundries to Expand CoWoS Silicon Interposer Supply - TradingKey <a href="https://news.google.com/rss/articles/CBMi2wFBVV95cUxPdDlpaDNpXzN6NnNVeWhSdkVIVXMxR1hmWlE1ZURpT1N2RzNvWGRHUWd2UlhkV2oydDAtVGJUTkxSZ2ZwbGVUX1J5bFpzdmF6bHFXY09iUU03Q0xROHk4VzRxLWlHNVd0QWhaZURxZFh1YkVhQXFrUjZqQm82TTM4X21RTW9xQXBlNHpLb25vSk5JS3VVZVFwVW9IWEk4OFFsX3JvbjFBTkd3Z1VhZ05EVDQ3d09yRzBhbmZnWFBFSXFlQ2lIVEFjSXktRzFmRldNM1lNTTJQOWJUMEU?oc=5" target="_blank">TSMC Q3 Profit May Hit Record, Teams Up With GlobalFoundries to Expand CoWoS Silicon Interposer Supply</a>&nbsp;&nbsp;<font color="#6f6f6f">TradingKey</font>

Oct 15, 2026

News Mention: Intel's Advanced Packaging Roadmap Revealed: EMIB-T Mass Production Next Year, Targeting 12x Reticle-Size AI...

Intel's Advanced Packaging Roadmap Revealed: EMIB-T Mass Production Next Year, Targeting 12x Reticle-Size AI Chips - BigGo Finance <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE9GOUgtSmcxN29pd0pMUERYOW1YNnA1X1YyYTZ1b19WUkJtR24zdUxrNGlYMk5BenB0VmRvTm02NHJHdk9iQkpUVFFEOUlHQWEtRF83N3pKRW1oRTdRODlGOHZoU1cya0phczZzLW5sMjl6QlAzZ0E?oc=5" target="_blank">Intel's Advanced Packaging Roadmap Revealed: EMIB-T Mass Production Next Year, Targeting 12x Reticle-Size AI Chips</a>&nbsp;&nbsp;<font color="#6f6f6f">BigGo Finance</font>

Oct 15, 2026

News Mention: Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem - digitimes <a...

Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem - digitimes <a href="https://news.google.com/rss/articles/CBMioAFBVV95cUxOaUc4QURocnBETWg4WllhUmV4TmxFVVJJSjVfRUFETDZwajJmQTh5VGJNNzBFeGJJS29rZHlQaU1TZFV3NDVCQnFBX0RYellwZWpnVHR3Wmx4LXhGU0YtRTF3b21hV0NON0w3RVhpeFN0NTlPN000cTIyMExYU3NHRUZlTGk1cjhCMHFEcHZDOG5VbVlWLXRpQTRJbHBOVmNM?oc=5" target="_blank">Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem</a>&nbsp;&nbsp;<font color="#6f6f6f">digitimes</font>

Oct 15, 2026

News Mention: TSMC Q3 2026 Earnings Call: 17 Key Questions and the Technological Transformation of the...

TSMC Q3 2026 Earnings Call: 17 Key Questions and the Technological Transformation of the AI Semiconductor Industry - semivision <a href="https://news.google.com/rss/articles/CBMifkFVX3lxTFBsNTBhdEpsQ3V2ZWoxSnJLanlKbUd2ZE9nMGRHZzlPTlg5M2dyVHc0UHYzMk9fbWZJV2FDaTcybUZMX285Y3RUOUNiNmxWWl9uN3hVbmVjb0NnR093bmQ2eHJ6OHJRUmppT0ktcXpRY3FmaUh2emExamhOczU1QQ?oc=5" target="_blank">TSMC Q3 2026 Earnings Call: 17 Key Questions and the Technological Transformation of the AI Semiconductor Industry</a>&nbsp;&nbsp;<font color="#6f6f6f">semivision</font>

Oct 16, 2026

News Mention: GlobalFoundries, TSMC partner for US silicon interposer supply - ET Datacenters <a href="https://news.google.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

GlobalFoundries, TSMC partner for US silicon interposer supply - ET Datacenters <a href="https://news.google.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

Oct 17, 2026

News Mention: TSMC Signals It Could Help Customers Using Intel's EMIB-T Packaging if Supply Falls Short...

TSMC Signals It Could Help Customers Using Intel's EMIB-T Packaging if Supply Falls Short - XenoSpectrum <a href="https://news.google.com/rss/articles/CBMickFVX3lxTE85S3ZCOHVsbXB2RmlhTnl6V3VuU3NkSDJuZktMWnhTdEp2dnh4OVdFd1A3ZS1sMjVDVjBJVXM5QkpidS1VZHNzWWJ3a0QwOWFfSnVnS0hnckZiRG5lYV9oMWM2cDdiQzBjdUR5aVBmUzAwUQ?oc=5" target="_blank">TSMC Signals It Could Help Customers Using Intel's EMIB-T Packaging if Supply Falls Short</a>&nbsp;&nbsp;<font color="#6f6f6f">XenoSpectrum</font>

Oct 19, 2026

News Mention: Amkor Bets approximately $2.3 Billion on Gwangju, South Korea AI Packaging Plant to Start...

Amkor Bets approximately $2.3 Billion on Gwangju, South Korea AI Packaging Plant to Start Production in 2027 - BigGo Finance <a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE8xMVJYSlJXMGxodFZTd1BTMldkTDRENlc5RUV2eGRZU2t4MU4zRjkxWUxfdU5KSGVITHdpT0hDbmYxekhUYWZFQzZscU5BT3JSaEdyRFVTUTY0VXRwSkJjemFXbkl1V3hQb245NGs3MnR3ZlhDLVE?oc=5" target="_blank">Amkor Bets approximately $2.3 Billion on Gwangju, South Korea AI Packaging Plant to Start Production in 2027</a>&nbsp;&nbsp;<font color="#6f6f6f">BigGo Finance</font>

Oct 21, 2026

News Mention: 2026 IMPACT | Kinsus Technology: The AI Chip Substrate Revolution — From Advanced Packaging...

2026 IMPACT | Kinsus Technology: The AI Chip Substrate Revolution — From Advanced Packaging Scaling and ABF Material Innovation to Next-Generation Glass Core Manufacturing Challenges - semivision <a href="https://news.google.com/rss/articles/CBMif0FVX3lxTFBxZDA4M1pCcDZOb1A1aW5NV1ZWamRERTh1T3djb0NDSzhWbzF3Um1RLXdrckVkTW03al9GWWxjdVRJcmliZlhWZ0xCMzJvUUctZVJueDNNSGRkNWUtdDVNRGdHOTBnS1FMaFdUMllObnhVX3NfM2U1YlpLaGlkQjg?oc=5" target="_blank">2026 IMPACT | Kinsus Technology: The AI Chip Substrate Revolution — From Advanced Packaging Scaling and ABF Material Innovation to Next-Generation Glass Core Manufacturing Challenges</a>&nbsp;&nbsp;<font color="#6f6f6f">semivision</font>

Oct 22, 2026

News Mention: Amkor Triples Gwangju Bet to $2.3B in AI Push [2026] - shattered.io <a href="https://news.google.com/rss/articles/CBMihAFBVV95cUxNVUpaZlBENW51WDBmOTAxN21FUTRFNy1fYThQU196LXpQUjFyN0wzNGRPekN1V0VxQ2hZcVhwQS1jQ3FLaUJmalJxS2FvT0pieGZZS2FZb1JOYUR4bjJJeXhEUnlZR0JLdmNOd0MwalJnSC1Xc1dSWW1SZDFEXy1EUWtDc24?oc=5"...

Amkor Triples Gwangju Bet to $2.3B in AI Push [2026] - shattered.io <a href="https://news.google.com/rss/articles/CBMihAFBVV95cUxNVUpaZlBENW51WDBmOTAxN21FUTRFNy1fYThQU196LXpQUjFyN0wzNGRPekN1V0VxQ2hZcVhwQS1jQ3FLaUJmalJxS2FvT0pieGZZS2FZb1JOYUR4bjJJeXhEUnlZR0JLdmNOd0MwalJnSC1Xc1dSWW1SZDFEXy1EUWtDc24?oc=5" target="_blank">Amkor Triples Gwangju Bet to $2.3B in AI Push [2026]</a>&nbsp;&nbsp;<font color="#6f6f6f">shattered.io</font>