Leaderboards / L1 Power & Cooling / #1
Vertiv
Active product Direct-to-chip Liquid Cooling Loop (cold plates + manifolds)·Power + thermal infrastructure for hyperscale + colocation data centers. UPS / switchgear / busway / rack PDU / liquid cooling. The most-mentioned name on hyperscaler datacenter capex commentary.
Rank in layer
#1
Confirmed customers
NVIDIA reference architecture, Multiple hyperscalers
Recent engine activity · 90 day window
Customer wins
1
Partnerships
0
Capital events
0
Hiring (60d)
2
Customer wins
1 signal in window
NVIDIA reference architecture
2026-03-18Vertiv Liebert XDU and rear-door heat exchanger products were named in NVIDIA GB200 NVL72 reference architecture, deployed at multiple hyperscaler GB200 sites.
↗ vertiv.com
Hiring focus
2 roles posted in last 60 days
operations
1 active posting
product
1 active posting
Active in
Products this company is committing to per engine analysis
- Direct-to-chip Liquid Cooling Loop (cold plates + manifolds)L1
- Coolant Distribution Unit (CDU)L1
- Rear-door Heat ExchangerL1
- Medium Voltage Switchgear (for utility interconnect)L1
- Busway / Rack PDU / Power DistributionL1
- Large-frame UPS SystemsL1
- Coolant Distribution Unit (CDU)/datacenter-cooling
- Rear-Door Heat Exchanger (RDHx)/datacenter-cooling
- Medium-Voltage Switchgear for Data Center Power Chain/datacenter-power
- Busway / Overhead Power Distribution for AI Racks/datacenter-power
- Large-Frame UPS for Hyperscale Critical Power/datacenter-power
- Large-Load Grid Interconnection & Substation Design for Hyperscale/datacenter-power
Share provenance
- site-estimate — /leaderboards/L1/vertivas of 2026-06-08
Notes
Layer L1 product mentions: Direct-to-chip Liquid Cooling Loop (cold plates + manifolds), Coolant Distribution Unit (CDU), Rear-door Heat Exchanger.
Leaderboard updated 2026-06-08 · Methodology