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Layer L1

Power & Cooling — Leaderboard

Ranked companies in the Power & Cooling layer of the AI infrastructure stack. Share figures carry an explicit provenance label (official, filing-derived, third-party, or site-estimate). Methodology →

#CompanyProductShareSourceCustomers
1VertivDirect-to-chip Liquid Cooling Loop (cold plates + manifolds)site-estimateNVIDIA reference architecture, Multiple hyperscalers
2nVent ElectricDirect-to-chip Liquid Cooling Loop (cold plates + manifolds)site-estimateMultiple hyperscalers (Schroff brand)
3EatonMedium Voltage Switchgear (for utility interconnect)site-estimateMultiple hyperscalers
4AsetekDirect-to-chip Liquid Cooling Loop (cold plates + manifolds)site-estimate
5CoolIT SystemsDirect-to-chip Liquid Cooling Loop (cold plates + manifolds)site-estimateCoreWeave
6IceotopeDirect-to-chip Liquid Cooling Loop (cold plates + manifolds)site-estimateMultiple HPC + AI customers
7Schneider ElectricMedium Voltage Switchgear (for utility interconnect)site-estimateMicrosoft
8Bloom EnergyBehind-the-meter Solid Oxide Fuel Cell (SOFC) Powersite-estimateAWS
9Modine ManufacturingTwo-phase / Immersion Coolingsite-estimate
10GE VernovaSTATCOM / Static Excitation / Grid Stabilization Power Electronicssite-estimate
11GeneracBattery Energy Storage System (BESS) + Microgrid Controlssite-estimate
12Munters GroupEvaporative / Hybrid Air Cooling AHUsite-estimate

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