Leaderboards / L1 Power & Cooling / #2
nVent Electric
Active product Direct-to-chip Liquid Cooling Loop (cold plates + manifolds)·Connection + protection products. Datacenter segment includes liquid-cooling infrastructure (CDUs, manifolds) following the EriksenLab + Trachte acquisitions. Direct-to-chip and immersion both addressed.
Rank in layer
#2
Confirmed customers
Multiple hyperscalers (Schroff brand)
Recent engine activity · 90 day window
Customer wins
0
Partnerships
0
Capital events
0
Hiring (60d)
3
Hiring focus
3 roles posted in last 60 days
sales
1 active posting
operations
1 active posting
engineering
1 active posting
Active in
Products this company is committing to per engine analysis
- Direct-to-chip Liquid Cooling Loop (cold plates + manifolds)L1
- Coolant Distribution Unit (CDU)L1
- Rear-door Heat ExchangerL1
- Direct-to-Chip Liquid Cooling (DLC)/datacenter-cooling
- Coolant Distribution Unit (CDU)/datacenter-cooling
- Rack-Level Liquid Cooling Enclosures & Manifolds (Schroff)/datacenter-cooling
- Direct-to-Chip Liquid Cooling SystemL1
- Direct-to-chip liquid cooling loop (cold plate + manifold)/datacenter-cooling
- Coolant Distribution Unit (CDU / XDU)/datacenter-cooling
- nVent Schroff liquid cooling enclosure / manifold/datacenter-cooling
- Direct-to-Chip Liquid Cooling Loops (cold plates + rack-level loops, incl. Liebert XDU / rear-door HX)L1
- Coolant Distribution Units (CDUs) — rack and row levelL1
Share provenance
- site-estimate — /leaderboards/L1/nvent-electricas of 2026-06-08
Notes
Layer L1 product mentions: Direct-to-chip Liquid Cooling Loop (cold plates + manifolds), Coolant Distribution Unit (CDU), Rear-door Heat Exchanger.
Leaderboard updated 2026-06-08 · Methodology