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Leaderboards / L1 Power & Cooling / #5

CoolIT Systems

Active product Direct-to-chip Liquid Cooling Loop (cold plates + manifolds)·Direct-to-chip liquid cooling specialist. OEM relationships with the big server vendors (Dell, HPE, Lenovo, Supermicro). Acquired by HMT in 2024; remains operationally independent.

Rank in layer

#5

Confirmed customers

CoreWeave

Recent engine activity · 90 day window

Customer wins

0

Partnerships

0

Capital events

0

Hiring (60d)

2

Hiring focus

2 roles posted in last 60 days

sales

1 active posting

engineering

1 active posting

Active in

Products this company is committing to per engine analysis

  • Direct-to-chip Liquid Cooling Loop (cold plates + manifolds)L1
  • Coolant Distribution Unit (CDU)L1
  • Direct-to-Chip Liquid Cooling (DLC)/datacenter-cooling
  • Coolant Distribution Unit (CDU)/datacenter-cooling
  • Direct-to-Chip Liquid Cooling SystemL1
  • Direct-to-chip liquid cooling loop (cold plate + manifold)/datacenter-cooling
  • Coolant Distribution Unit (CDU / XDU)/datacenter-cooling
  • Direct-to-Chip Liquid Cooling Loops (cold plates + rack-level loops, incl. Liebert XDU / rear-door HX)L1
  • Coolant Distribution Units (CDUs) — rack and row levelL1
  • Direct-to-Chip (D2C) Liquid Cooling Loop/datacenter-cooling

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Notes

Layer L1 product mentions: Direct-to-chip Liquid Cooling Loop (cold plates + manifolds), Coolant Distribution Unit (CDU).

Leaderboard updated 2026-06-08 · Methodology