Foundry Capacity — Timeline
35 milestones, source-traced.
Nov 1, 2024
Funding: TSMC finalized $6.6 billion in direct CHIPS Act funding plus up to $5 billion...
TSMC finalized $6.6 billion in direct CHIPS Act funding plus up to $5 billion in low-cost loans to support Arizona fab construction.
funding-research →Nov 1, 2024
Funding: TSMC's Arizona operations secured a $6.6 billion direct funding award plus up to $5...
TSMC's Arizona operations secured a $6.6 billion direct funding award plus up to $5 billion in loans under the U.S. CHIPS and Science Act to support its $65 billion investment in three Phoenix fabs.
funding-research →Nov 26, 2024
Funding: Intel finalized a $7.86 billion CHIPS Act direct grant plus up to $11 billion...
Intel finalized a $7.86 billion CHIPS Act direct grant plus up to $11 billion in loans for fab expansion in Arizona, New Mexico, Ohio, and Oregon.
funding-research →Nov 26, 2024
Funding: Intel Foundry received $7.86 billion in finalized US CHIPS Act direct funding for fab...
Intel Foundry received $7.86 billion in finalized US CHIPS Act direct funding for fab expansion in Arizona, New Mexico, Ohio, and Oregon.
funding-research →Mar 1, 2025
Acquisition: TSMC announced a planned joint venture to acquire control of Intel's manufacturing business as...
TSMC announced a planned joint venture to acquire control of Intel's manufacturing business as part of a broader U.S. semiconductor strategy.
funding-research →Mar 3, 2025
Partnership: TSMC and U.S. President Donald Trump announced an additional $100 billion investment in Arizona...
TSMC and U.S. President Donald Trump announced an additional $100 billion investment in Arizona to build three new 2nm/3nm fabs, two advanced packaging facilities, and an R&D center, bringing total U.S. investment to $165 billion.
funding-research →Jun 1, 2025
Funding: Intel received a $5 billion investment from NVIDIA pledged for foundry expansion.
funding-research →Jun 1, 2025
Funding: Intel received a $2.5 billion investment from SoftBank pledged for foundry expansion.
funding-research →Jun 1, 2025
Customer Win: Samsung Foundry signed an 8-year, $16.5 billion AI chip supply deal with Tesla to...
Samsung Foundry signed an 8-year, $16.5 billion AI chip supply deal with Tesla to produce next-generation AI5 and AI6 chips.
funding-research →Jun 1, 2025
Product Launch: TSMC began mass production of 2-nanometre chips in 2025.
funding-research →Jun 1, 2025
Ipo Event: Intel announced in early 2025 that Intel Foundry Services would be spun off into...
Intel announced in early 2025 that Intel Foundry Services would be spun off into a separate subsidiary with its own board of directors, enabling it to seek outside investment and potentially pursue a future IPO, news that caused Intel's stock to rise 8%.
funding-research →Jul 1, 2025
Partnership: TSMC announced an additional $100 billion investment in Arizona to build a 'gigafab' cluster...
TSMC announced an additional $100 billion investment in Arizona to build a 'gigafab' cluster of six facilities.
funding-research →Jul 29, 2025
Partnership: Samsung Electronics joined SK Hynix, SK Telecom, Korea Telecom, and Aramco in Rebellions' $150–200...
Samsung Electronics joined SK Hynix, SK Telecom, Korea Telecom, and Aramco in Rebellions' $150–200 million pre-IPO round at a $1 billion pre-round valuation.
funding-research →Sep 1, 2025
Acquisition: Altera (an Intel Company) was sold to Silver Lake for $4.46 billion for a...
Altera (an Intel Company) was sold to Silver Lake for $4.46 billion for a 51% stake, implying an $8.75 billion total valuation for Altera.
funding-research →Sep 12, 2025
Acquisition: Intel sold a 51% controlling stake in Altera to Silver Lake for $4.46 billion...
Intel sold a 51% controlling stake in Altera to Silver Lake for $4.46 billion in cash, implying a total Altera valuation of $8.75 billion.
funding-research →Mar 1, 2026
CoWoS advanced packaging is sold out through 2027 (52-78 week lead times); NVIDIA booked...
CoWoS advanced packaging is sold out through 2027 (52-78 week lead times); NVIDIA booked ~60% of 2026 output.
Knowledge base →Mar 31, 2026
TSMC's N3 process is sold out, with lead times exceeding 50 weeks and capacity...
TSMC's N3 process is sold out, with lead times exceeding 50 weeks and capacity booked 18-24 months out.
Knowledge base →Apr 22, 2026
News Mention: Lam Research (LRCX) filed SEC Form 8-K on 2026-04-22 (period 2026-04-22); items 2.02,9.01.
sec_edgar →Apr 23, 2026
Earnings: Lam Research (LRCX) filed SEC Form 10-Q on 2026-04-23 (period 2026-03-29).
sec_edgar →Apr 29, 2026
News Mention: KLA (KLAC) filed SEC Form 8-K on 2026-04-29 (period 2026-04-29); items 2.02,9.01.
sec_edgar →Apr 30, 2026
Earnings: KLA (KLAC) filed SEC Form 10-Q on 2026-04-30 (period 2026-03-31).
sec_edgar →May 7, 2026
News Mention: KLA (KLAC) filed SEC Form 8-K on 2026-05-07 (period 2026-05-07); items 8.01,9.01.
sec_edgar →May 14, 2026
News Mention: Applied Materials (AMAT) filed SEC Form 8-K on 2026-05-14 (period 2026-05-14); items 2.02,9.01.
sec_edgar →May 21, 2026
Earnings: Applied Materials (AMAT) filed SEC Form 10-Q on 2026-05-21 (period 2026-04-26).
sec_edgar →May 28, 2026
Partnership: Samsung Electronics participated as a strategic infrastructure partner alongside BlackRock, SK Hynix, and Micron...
Samsung Electronics participated as a strategic infrastructure partner alongside BlackRock, SK Hynix, and Micron in Anthropic's $65 billion Series H round at a $965 billion valuation.
funding-research →May 28, 2026
Partnership: Samsung Electronics joined Anthropic's $65 billion Series H round as a strategic infrastructure partner...
Samsung Electronics joined Anthropic's $65 billion Series H round as a strategic infrastructure partner alongside SK Hynix and Micron, with Anthropic post-money valued at $965 billion.
funding-research →Jun 1, 2026
The binding AI-chip constraints in 2026 are advanced-node (N3→N2) + CoWoS + HBM4 —...
The binding AI-chip constraints in 2026 are advanced-node (N3→N2) + CoWoS + HBM4 — not raw N3 wafers alone.
Knowledge base →Jun 1, 2026
HBM4 memory is sold out through 2026 with a reported ~171% year-over-year price surge,...
HBM4 memory is sold out through 2026 with a reported ~171% year-over-year price surge, compounding the foundry/packaging bottleneck.
Knowledge base →Jun 1, 2026
Arm's CEO has called memory 'the toughest' constraint, ranking it alongside advanced packaging above...
Arm's CEO has called memory 'the toughest' constraint, ranking it alongside advanced packaging above raw wafer supply.
Knowledge base →Jun 1, 2026
TSMC plans to roughly 3.5-4x CoWoS capacity to ~130k wafers/month by end-2026 versus end-2024.
Knowledge base →Jun 1, 2026
The newest 2026 accelerators are migrating to N2 (e.g. AMD MI400 on 2nm), shifting...
The newest 2026 accelerators are migrating to N2 (e.g. AMD MI400 on 2nm), shifting the binding constraint forward from N3.
Knowledge base →Jun 1, 2026
Samsung Foundry is picking up overflow demand as TSMC's leading-edge capacity saturates.
Knowledge base →Jun 1, 2026
Intel Foundry is courting AI-chip customers as a second source to TSMC.
Knowledge base →Jun 1, 2026
Foundry allocation — who gets wafers and packaging slots — has become a primary...
Foundry allocation — who gets wafers and packaging slots — has become a primary determinant of who ships AI chips.
Knowledge base →Jun 12, 2026
News Mention: KLA (KLAC) filed SEC Form 8-K on 2026-06-12 (period 2026-06-11); items 5.03,9.01.
sec_edgar →
Milestones merged from 0 curated events, 10 verified facts (with observed dates), and 25 business signals from the last 24 months. Deduped by date + label; curated entries take precedence.
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