Leaderboards / L3 HBM & Packaging / #4
SK Hynix
Active product HBM3E DRAM Stack·HBM market leader (~50% share). HBM3E volume production lead; HBM4 sample shipments. Primary supplier into NVIDIA H100/H200/B200 + B100 platforms.
Rank in layer
#4
Confirmed customers
NVIDIA, AMD
Recent engine activity · 90 day window
Customer wins
0
Partnerships
0
Capital events
4
Hiring (60d)
0
Capital events
Funding, earnings filings, and IPO-related signals
ipo event
2026-07-10SK Hynix is set to begin trading on Nasdaq via depositary receipts, raising $29.4 billion (₩45.45 trillion) in a U.S. listing managed by Goldman Sachs and JP Morgan.
↗ sdxcentral.comipo event
2026-07-10SK Hynix plans to raise $29.4 billion (45.45 trillion won) via a Nasdaq IPO, with trading expected to begin on July 10, 2026.
↗ youtube.comipo event
2026-06-24SK Hynix filed regulatory paperwork for a $29.4 billion (45.45 trillion won) US listing, with trading expected to start July 10, 2026.
↗ sdxcentral.comipo event
2026-06-24SK Hynix filed for a $29.4 billion (45.45 trillion won) US IPO on Nasdaq on June 24, 2026, with trading set to begin July 10, 2026, to fund HBM production capacity expansion.
↗ youtube.com
Active in
Products this company is committing to per engine analysis
- HBM3E 12-High Stack/hbm-memory
- HBM4 Stack/hbm-memory
- HBM4 Logic Base Die on Advanced Node (3nm/4nm)/hbm-memory
- HBM-Integrated AI Inference Memory Architecture (LPDDR5X + HBM Hybrid)/hbm-memory
- HBM3E 12-high 36GB Stack/hbm-memory
- HBM4 12-high 36GB Stack/hbm-memory
- HBM logic base die (3nm / 4nm foundry-fabricated)/hbm-memory
Notes
Active in: HBM3E DRAM Stack, HBM4 DRAM Stack, Cu-Cu Hybrid Bonding for Post-HBM4 Stacked Memory
Leaderboard updated 2026-06-26 · Methodology