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Leaderboards / L3 HBM & Packaging / #7

Samsung Electronics

Active product HBM3E / HBM4 stacked memory·HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.

Rank in layer

#7

Confirmed customers

NVIDIA

Recent engine activity · 90 day window

Customer wins

1

Partnerships

0

Capital events

0

Hiring (60d)

2

Customer wins

1 signal in window

  • NVIDIA

    2026-04-10

    Samsung Electronics achieved HBM3E qualification for NVIDIA (Q4 2025) after multi-quarter delay, beginning volume shipments into NVIDIA platforms.

    ↗ news.samsung.com

Product launches

1 launch in window

  • Launch

    2026-03-19

    ai_synthesis_sdk

Hiring focus

2 roles posted in last 60 days

engineering

2 active postings

Active in

Products this company is committing to per engine analysis

  • HBM3E / HBM4 stacked memoryL2
  • HBM3E Stack/hbm-memory
  • HBM4 Stack (12-high 36GB, 2048-bit, >1.6 TB/s per stack)/hbm-memory
  • HBM Known-Good-Stack (KGS/KGSD) Test Programs/hbm-memory
  • HBM4 12-high stacked DRAML2
  • HBM Known-Good-Stack (KGS) testL2
  • HBM4 Stack/hbm-memory
  • HBM4 StackL2
  • HBM3E StackL2

Share provenance

Notes

Layer L2 product mentions: HBM3E / HBM4 stacked memory.

Leaderboard updated 2026-06-11 · Methodology