Leaderboards / L3 HBM & Packaging / #5
Micron Technology
Active product HBM3E DRAM Stack·HBM third entrant (~20% share). US-strategic supplier; CHIPS Act direct beneficiary. HBM3E 12-Hi stack the current product anchor; HBM4 roadmap announced for 2026.
Rank in layer
#5
Confirmed customers
–
Recent engine activity · 90 day window
Customer wins
0
Partnerships
4
Capital events
1
Hiring (60d)
0
Partnerships & acquisitions
4 signals in window
Partnerpartnership
2026-06-22Micron and Anthropic announced a multi-year strategic agreement covering memory and storage architecture design, a multi-year supply deal, and enterprise AI adoption, with Micron making a strategic investment in Anthropic's Series H funding round.
↗ startuphub.aiPartnerpartnership
2026-06-22Micron signed a strategic agreement with Anthropic covering memory/storage architecture design, a multi-year supply contract, enterprise adoption of Claude, and Micron's investment in Anthropic's Series H round.
↗ youtube.comPartnerpartnership
2026-06-10Micron selected Bechtel as the construction partner for its Central New York semiconductor fabrication project, part of the $100 billion fab initiative.
↗ youtube.comPartnerpartnership
2026-06-10Micron selected Bechtel as the construction partner for its New York semiconductor fabrication project.
↗ startuphub.ai
Capital events
Funding, earnings filings, and IPO-related signals
earnings
2026-06-25Micron Technology (MU) filed SEC Form 10-Q on 2026-06-25 (period 2026-05-28).
↗ sec.gov
Active in
Products this company is committing to per engine analysis
- CXL Memory Expansion Module/cxl-memory-fabric
- Leo CXL Memory Controller/cxl-memory-fabric
- Micron CZ120 CXL Memory Expansion Module/cxl-memory-fabric
- HBM3E 12-High Stack/hbm-memory
- HBM4 Stack/hbm-memory
- HBM-Integrated AI Inference Memory Architecture (LPDDR5X + HBM Hybrid)/hbm-memory
- HBM3E 12-high 36GB Stack/hbm-memory
- HBM4 12-high 36GB Stack/hbm-memory
Notes
Active in: HBM3E DRAM Stack, HBM4 DRAM Stack
Leaderboard updated 2026-06-26 · Methodology