Leaderboards / L3 HBM & Packaging / #6
Micron Technology
Active product HBM3E / HBM4 stacked memory·HBM third entrant (~20% share). US-strategic supplier; CHIPS Act direct beneficiary. HBM3E 12-Hi stack the current product anchor; HBM4 roadmap announced for 2026.
Rank in layer
#6
Confirmed customers
–
Recent engine activity · 90 day window
Customer wins
0
Partnerships
0
Capital events
0
Hiring (60d)
2
Hiring focus
2 roles posted in last 60 days
engineering
2 active postings
Active in
Products this company is committing to per engine analysis
- HBM3E / HBM4 stacked memoryL2
- HBM3E Stack/hbm-memory
- HBM4 Stack (12-high 36GB, 2048-bit, >1.6 TB/s per stack)/hbm-memory
- HBM4 12-high stacked DRAML2
- HBM4 Stack/hbm-memory
- HBM4 StackL2
- HBM3E StackL2
Share provenance
- site-estimate — /leaderboards/L2/micron-technologyas of 2026-06-08
Notes
Layer L2 product mentions: HBM3E / HBM4 stacked memory.
Leaderboard updated 2026-06-11 · Methodology