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Leaderboards / L2 Silicon & Memory / #8

TSMC

Active product CoWoS 2.5D advanced packaging (HBM-on-logic)·CoWoS advanced packaging — the constrained step for AI accelerator + HBM integration. CoWoS-S / -L / -R / SoIC capacity expansion is the most-tracked supply-side number in 2026 AI infrastructure.

Rank in layer

#8

Confirmed customers

NVIDIA

Recent engine activity · 90 day window

Customer wins

1

Partnerships

0

Capital events

0

Hiring (60d)

2

Customer wins

1 signal in window

  • NVIDIA

    2026-03-20

    TSMC is NVIDIA's sole supplier of CoWoS-L 2.5D advanced packaging (HBM interposer + base die), with capacity sold out through 2026 driving capex doubling in 2025-2026.

    ↗ tsmc.com

Hiring focus

2 roles posted in last 60 days

engineering

2 active postings

Active in

Products this company is committing to per engine analysis

  • CoWoS 2.5D advanced packaging (HBM-on-logic)L2
  • HBM3E Stack/hbm-memory
  • HBM4 Stack (12-high 36GB, 2048-bit, >1.6 TB/s per stack)/hbm-memory
  • CoWoS 2.5D Advanced Package for HBM-on-Logic/hbm-memory
  • HBM Known-Good-Stack (KGS/KGSD) Test Programs/hbm-memory
  • HBM Known-Good-Stack (KGS) testL2
  • CoWoS-L 2.5D advanced packagingL2
  • CoWoS 2.5D Advanced Packaging for HBM Integration/hbm-memory
  • HBM Known-Good-Stack (KGS/KGSD) Test/hbm-memory
  • TSV Process for HBM Interposer / Base Die/hbm-memory
  • HBM3E StackL2
  • CoWoS-L 2.5D Advanced PackagingL2

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Notes

Layer L2 product mentions: CoWoS 2.5D advanced packaging (HBM-on-logic).

Leaderboard updated 2026-06-08 · Methodology