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Leaderboards / L2 Silicon & Memory / #4

SK Hynix

Active product HBM3E / HBM4 stacked memory·HBM market leader (~50% share). HBM3E volume production lead; HBM4 sample shipments. Primary supplier into NVIDIA H100/H200/B200 + B100 platforms.

Rank in layer

#4

Confirmed customers

NVIDIA, AMD

Recent engine activity · 90 day window

Customer wins

0

Partnerships

0

Capital events

0

Hiring (60d)

2

Hiring focus

2 roles posted in last 60 days

engineering

2 active postings

Active in

Products this company is committing to per engine analysis

  • HBM3E / HBM4 stacked memoryL2
  • Cu-Cu Hybrid Bonding (post-HBM4 stacked memory)L2
  • HBM4 Stack (12-high 36GB, 2048-bit, >1.6 TB/s per stack)/hbm-memory
  • CoWoS 2.5D Advanced Package for HBM-on-Logic/hbm-memory
  • Cu-Cu Hybrid Bonding for Post-HBM4 Stacked Memory/hbm-memory
  • HBM4 12-high stacked DRAML2
  • Cu-Cu hybrid bonding (post-HBM4 stacked memory)L2
  • HBM4 Stack/hbm-memory
  • Cu-Cu Hybrid Bonding for post-HBM4 Stacked Memory/hbm-memory
  • HBM4 StackL2
  • Cu-Cu Hybrid Bonding for stacked memoryL2
  • HBM4/hbm-memory

Share provenance

Notes

Layer L2 product mentions: HBM3E / HBM4 stacked memory, Cu-Cu Hybrid Bonding (post-HBM4 stacked memory).

Leaderboard updated 2026-06-08 · Methodology